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NXP joins Auto-ISAC to collaborate on security challenges of connected cars

02/24/2017  NXP Semiconductors N.V., the world's largest supplier of automotive semiconductors, announced that it has joined the Automotive Information Sharing and Analysis Center (Auto-ISAC).

Gigaphoton extends the lifetime of collector mirrors in EUV pilot light sources

02/23/2017  Company demonstrates that magnetic-field debris mitigation, a new technology, extends collector mirror lifetime in Pilot light source for EUV lithography mass production plants, a major step towards eliminating bottlenecks.

STMicroelectronics works with Sigfox to extend plug-and-play IoT security to industrial and consumer device makers

02/23/2017  STMicroelectronics (NYSE: STM) announced the expansion of its STSAFE family of secure elements with the introduction of a powerful plug-and-play solution that provides state-of-the-art security features to devices connected to the Sigfox low-power wide-area network (LPWAN).

LG Innotek unveils the world's first 70mW UV-C LED

02/23/2017  LG Innotek today announced that the company has developed the world's first 70mw UV-C LED for sterilization applications.

KLA-Tencor introduces new metrology systems for leading-edge integrated circuit device technologies

02/23/2017  KLA-Tencor Corporation today introduced four innovative metrology systems that enable development and high-volume manufacturing of sub-10nm integrated circuit (IC) devices.

Microhotplates for a smart gas sensor

02/22/2017  Toyohashi University of Technology researchers have developed microhotplates (MHPs), in which an SU-8 photoresist was employed as a supporting material. The MHP can moderate the requirement for the layout design and the process condition of integrated smart gas sensors.

Improved polymer and new assembly method for ultra-conformable 'electronic tattoo' devices

02/22/2017  Process uses household inkjet printer without soldering to create 750nm-thin elastomeric sheet.

ClassOne initiative aims to reduce CoO in ?200mm copper plating

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

North American semiconductor equipment industry posts January 2017 billings

02/22/2017  North America-based manufacturers of semiconductor equipment posted $1.86 billion in billings worldwide in January 2017 (three-month average basis).

New window into the nanoworld

02/21/2017  Scientists combine the ultra-fast with the ultra-small to pioneer microscopy at terahertz frequencies.

Flemish government increases financial support of imec

02/21/2017  Today, the research and innovation hub in nanoelectronics and digital technology imec, and the Flemish Government announced a new, 5-year strategic commitment that aims at strengthening the pioneering role of Flanders' renowned research hub.

GlobalFoundries announces availability of 45nm RF SOI

02/21/2017  Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations.

Brooks Instrument names Mohamed Saleem as new Chief Technology Officer

02/21/2017  Mohamed Saleem has joined Brooks Instrument as the company's new chief technology officer (CTO), where he will oversee its California-based technology development center.

Technologies to extend semiconductor scaling

02/20/2017  An Steegen reveals some of the secrets of semiconductor scaling – a pipeline full of materials, device architectures and advanced techniques that promise to further extend semiconductor scaling.

Innovations at 7nm to keep MooreÂ’s Law alive

02/20/2017  EUV, cobalt contacts, are expected to be introduced at the 7nm node by several semiconductor manufacturers.

Chips must learn how to feel pain and how to cure themselves

02/20/2017  Two specialists in the field explain how to make self-healing chips.

Photonics in silicon R&D toward Tb/s

02/20/2017  COSMICC Project and AIM Program developments

3D processing at Tohoku U

02/20/2017  At the recent IEEE 3DIC Conference, Koyanagi and co-workers at Tohoku Univ reported on their studies of Ti as a 3D TSV barrier layer.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.