02/13/2017 Picosun Oy, a provider of high quality Atomic Layer Deposition (ALD) technology, announced a collaboration with Osram Opto Semiconductors and other partners to create a new generation of advanced LED lighting solutions.
02/13/2017 The company will continue investing in its wafer plants in the United States and Germany, expand its capacity in Singapore, and construct a facility to produce 12-inch wafers in Chengdu, China in order to satisfy Chinese and global demands for the company's 22FDX technology.
02/10/2017 Applied Materials, Inc. announced today that Dr. Om Nalamasu, Senior Vice President and Chief Technology Officer, has been elected to the U.S. National Academy of Engineering (NAE), one of the highest professional honors for engineers.
02/10/2017 The flat-panel display (FPD) industry is in the midst of a historic wave of building new factories to manufacture active matrix organic light emitting diode (AMOLED) displays.
02/09/2017 Grant A. Pierce, chief executive officer (CEO) of Sonics, Inc. was elected by the Board of Directors of the Electronic System Design Alliance (ESD Alliance) to serve as its chairman.
02/09/2017 Toshiba Corporation today announced that it has started construction of a new semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the companyÂ’s main memory production base.
02/09/2017 University of Pennsylvania researchers are now among the first to produce a single, three-atom-thick layer of a unique two-dimensional material called tungsten ditelluride.
02/08/2017 A team of researchers, affiliated with UNIST has created a new technique that greatly enhances the performance of Schottky Diodes (metal-semiconductor junction) used in electronic devices.
02/08/2017 A new study, affiliated with UNIST has introduced a novel method for fabrication of world's thinnest oxide semiconductor that is just one atom thick. This may open up new possibilities for thin, transparent, and flexible electronic devices, such as ultra-small sensors.
02/08/2017 At the 2017 International Solid-State Circuits Conference in San Francisco (US), imec, Holst Centre and ROHM today presented an all-digital phase-locked loop (ADPLL) for Internet-of-Things (IoT) radio transceivers.
02/07/2017 A team of scientists from the Energy Department's National Renewable Energy Laboratory (NREL) determined that surface recombination limits the performance of polycrystalline perovskite solar cells.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
