Featured Content




Entegris announces higher-purity gas purification system platform with expanded manufacturing in Asia

02/07/2017  New media provides yield improvements in systems for advanced semiconductor and LED applications.

New photorelay from Toshiba features industry's smallest package

02/06/2017  Toshiba America Electronic Components, Inc. (TAEC) has added a new photorelay to its extensive lineup of photocouplers.

Kinetics Holding acquires U.S. semiconductor equipment company Wafab International

02/06/2017  Kinetics Holding GmbH announced today the acquisition of Wafab International Inc., a global supplier of wet processing stations and components.

Marcel Pelgrom of NXP named recipient of prestigious IEEE Gustav Robert Kirchhoff Award

02/06/2017  NXP Semiconductors N.V. today announced that Marcel Pelgrom is the recipient of the 2017 Gustav Robert Kirchhoff Award from the IEEE.

Towards new IT devices with stable and transformable solitons

02/06/2017  Multi-digit systems, solitonics and brain-like machines

ISS Europe 2017: European innovation leadership

02/06/2017  Electronics manufacturing solutions for Automotive, Smart Manufacturing and Healthcare enabling the future of European technology.

Veeco enters into agreement to acquire Ultratech

02/03/2017  The Boards of Directors of both Veeco and Ultratech have unanimously approved the transaction.

Germanium outperforms silicon in energy efficient transistors with n- und p- conduction

02/03/2017  A team of scientists from the Nanoelectronic Materials Laboratory (NaMLab gGmbH) and the Cluster of Excellence Center for Advancing Electronics Dresden (cfaed) at the Dresden University of Technology have demonstrated the world-wide first transistor based on germanium that can be programmed between electron- (n) and hole- (p) conduction.

Full(erene) potential

02/03/2017  The addition of specific molecules to 'trap' charge carriers in semiconducting polymers proves to be a powerful method of mastering the materials' electrical properties.

Qualcomm and TDK announce launch of joint venture

02/03/2017  Qualcomm Incorporated and TDK Corporation today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd.

Leti presents first-ever results in LED pixelization & record high-resolution for micro-displays at Photonics West

02/03/2017  Leti, a research institute of CEA Tech, today announced it has developed a ?LED fabrication process to create high-resolution arrays at 10-micron pitch.

Amkor Technology to acquire NANIUM

02/02/2017  Amkor Technology, Inc. and NANIUM S.A. today announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions.

Micron CEO announces upcoming retirement

02/02/2017  Micron Technology, Inc. today announced the upcoming retirement of its Chief Executive Officer, Mark Durcan.

Toward all-solid lithium batteries

02/02/2017  Researchers investigate mechanics of lithium sulfides, which show promise as solid electrolytes.

1000 times more efficient nano-LED opens door to faster microchips

02/02/2017  The electronic data connections within microchips are increasingly becoming a bottleneck in the exponential growth of data traffic. Optical connections are the obvious successors but optical data transmission requires an adequate nanoscale light source, and this has been lacking. Scientists at Eindhoven University of Technology have created a light source that has the right characteristics: a nano-LED that is 1000 times more efficient than its predecessors, and is capable of handling gigabits per second.

Thin, flexible, light-absorbent material for energy and stealth applications

02/02/2017  Transparent window coatings that keep buildings and cars cool on sunny days. Devices that could more than triple solar cell efficiencies. Thin, lightweight shields that block thermal detection. These are potential applications for a thin, flexible, light-absorbing material developed by engineers at the University of California San Diego.

Artificially introduced atomic-level sensors enable measurements of the electric field within a working semiconductor device

02/02/2017  A group of Takayuki Iwasaki, Mutsuko Hatano and colleagues at the Tokyo Institute of Technology, the Japan Science and Technology Agency (JST) and Toshiharu Makino at the National Institute of Advanced Industrial Science and Technology (AIST) has reported a new method for sensing internal electric fields at the interior of operating semiconductor devices.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors