Featured Content




Reliability Symposium coming to Silicon Valley

02/01/2017  The Silicon Valley Reliability Symposium will be held on Thursday, February 9th, 2017 at the Biltmore Hotel and Suites in Santa Clara, CA from 8:00 AM until noon.

Highly sensitive gas sensors for volatile organic compound detection

02/01/2017  In an effort to improve VOC detection, a collaboration of Japanese researchers from Kumamoto University, Fukuoka Industrial Technology Center, and Tohoku University set out to improve sensor sensitivity by modifying the particle and pore sizes of Tin-dioxide (SnO2) nanocrystals on sensing film.

SEMI 2020: "There are far better things ahead than any we leave behind"

02/01/2017  “Do not go where the path may lead, go instead where there is no path and leave a trail,” was how I started last weekÂ’s article. In that article we looked back on 2016 and the incredible progress of the industry and how it continually cuts new trail and keeps moving at the speed of MooreÂ’s Law.

Without technology, China's "MIC 2025" results for ICs likely to fall woefully short of its goals

02/01/2017  IC Insights believes China's self-sufficiency targets for ICs of 40% in 2020 and 70% in 2025 are unrealistic.

The world's smallest reflector-type high brightness 3-color LED

01/31/2017  ROHM has recently announced the availability of an ultra-compact reflector-type LED optimized for consumer devices such as matrix light sources for gaming and wearables that demand increased miniaturization.

CVD announces expansion plans for Tantaline in US

01/31/2017  CVD Equipment Corporation, a provider of chemical vapor deposition systems, announced today that its CVD Materials Corporation subsidiary plans to open a US facility for expansion of the corrosion resistant coating services currently offered through its Tantaline CVD ApS subsidiary in Nordborg, Denmark.

The world's first heat-driven transistor

01/31/2017  The heat-driven transistor opens the possibility of many new applications such as detecting small temperature differences, and using functional medical dressings in which the healing process can be monitored.

FlexTech announces contract for battery development with ITN Energy Systems

01/31/2017  FlexTech, a SEMI strategic association partner, today announced a contract with ITN Energy Systems of Littleton, CO to develop and produce a flexible, solid-state lithium battery reducing packaging bulk by integrating a thin, flexible ceramic substrate.

Research and Markets releases new report on semiconductor epitaxy wafer manufacturing market

01/30/2017  Globally, development of efficient and advanced technology, rising demand for electronic devices including laptops, tablets, gaming consoles, smartphones, flourishing electronics and semiconductor industry, and advantageous properties of semiconductor Epi' (Epitaxy) wafer are the prime growth drivers of the semiconductor Epi' (Epitaxy) wafer manufacturing market.

Sequans opens R&D facility in Sophia Antipolis, France

01/30/2017  LTE for IoT chip maker Sequans Communications S.A. today announced the opening of a new development site in Sophia Antipolis, on the Côte dÂ’Azur, in the south of France.

Axcelis announces multiple orders for 'Purion H' from  memory chipmakers in Asia Pacific

01/30/2017  Axcelis Technologies, Inc. announced today that it has received orders for the Purion H high current implanter from two leading manufacturers of memory devices in the Asia Pacific region.

Understanding breakups

01/30/2017  A new model describing the deformation and breakup of droplets could help improve nanoscale printing and spraying.

Top 3 trends impacting the global field-programmable gate array market through 2021

01/27/2017  TechnavioÂ’s latest market research report on the global field-programmable gate array (FPGA) market provides an analysis of the most important trends expected to impact the market outlook from 2017-2021.

New 'needle-pulse' beam pattern packs a punch

01/27/2017  A new beam pattern devised by University of Rochester researchers could bring unprecedented sharpness to ultrasound and radar images, burn precise holes in manufactured materials at a nano scale -- even etch new properties onto their surfaces.

MACOM successfully completes acquisition of AppliedMicro

01/27/2017  MACOM Technology Solutions Holdings, Inc. today announced that it has successfully completed its previously announced acquisition of Applied Micro Circuits Corporation.

Global semiconductor chip packaging market dominated by 3DIC through-silicon via stacks packaging technique

01/26/2017  The global semiconductor chip packaging market is expected to grow at a CAGR of more than 31% during the forecast period.

ams announces completion of transaction to acquire Heptagon

01/25/2017  ams, a worldwide supplier of high-performance sensor and analog solutions, announces the completion of the transaction to acquire 100% of the shares in Heptagon and related capital.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors