01/25/2017 This combined with a significant increase in billings puts 2016 equipment sales of North American manufacturers well above 2015 levels and well positioned for 2017.
01/24/2017 Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PMÂ’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.
01/24/2017 At next weekÂ’s SPIE Photonics West in San Francisco, imec, a research and innovation hub in nano-electronics and digital technologies, will introduce a new image sensor with integrated color (Red Green Blue, RGB) and narrow-band near-infrared (NIR) filters.
01/24/2017 Fueled by lightning-fast demand for ubiquitous connectivity, the number of connected Internet of Things (IoT) devices globally will jump by 15 percent year-over-year to 20 billion in 2017, according to new analysis from IHS Markit.
01/23/2017 Demand for TV panels in terms of area is forecast to reach 143 million square meters in 2017, up 8 percent from 2016, contributing to a 6 percent growth in the overall display market, according to IHS Markit.
01/23/2017 A team of researchers, affiliated with UNIST has recently announced that they have successfully developed a new way to increase energy efficiency of metal-air batteries which are next-generation energy devices by using a conducting polymer.
01/23/2017 STATS ChipPAC Pte. Ltd. announced today that it has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2016 Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers.
01/20/2017 A simple technique for producing oxide nanowires directly from bulk materials could dramatically lower the cost of producing the one-dimensional (1D) nanostructures.
01/20/2017 Breakthrough results pave the way to multi-layer 3D ICs with high density interconnects realized by automated wafer-to-wafer bonding technology.
01/19/2017 Richard Beyer and John Hodgson will retire from the Company's Board of Directors, effective as of the Company's 2017 Annual Meeting of Shareholders.
01/19/2017 Researchers have demonstrated the first important step toward integrating atomically precise graphene nanoribbons (APGNRs) onto nonmetallic substrates.
01/18/2017 According to the latest market study released by Technavio, the global large area displays market is expected to reach USD 78.41 billion by 2021, growing at a CAGR of close to 2%.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
