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01/18/2017  AGC Asahi Glass (AGC), a manufacturer of glass, chemicals and high-tech materials, today announced it has developed a diverse line of glass substrates specifically designed for semiconductor packaging applications and semiconductor manufacturing process support.

01/17/2017  Dr. Rhines is being recognized for leadership and technology innovation in integrated circuit design and automation.

01/17/2017  DGIST research developed a technology to coat metal with several nanometers of semiconducting materials.

01/17/2017  Based on a study of the optical properties of novel ultrathin semiconductors, researchers of Ludwig-Maximilians-Universitaet (LMU) in Munich have developed a method for rapid and efficient characterization of these materials.

01/17/2017  ams AG today launched the world's first series of cost-effective multispectral sensor-on-chip solutions, opening the way for a new generation of spectral analyzers for consumer and industrial applications.

01/17/2017  Dow Corning significantly expanded the design flexibilities for LED packaging manufacturers today with the addition of three new highly reflective silicone coatings to its fast-growing portfolio of advanced LED solutions.

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.

01/13/2017  IBM this week announced new, all-flash storage solutions designed for midrange and large enterprises, where high availability, continuous up-time, and performance are critical.

01/13/2017  New classes of printable electrically conducting polymer materials make better electrodes for plastic electronics and advanced semiconductor devices.

01/12/2017  Toshiba America Electronic Components, Inc. this week announced the launch of its JEDEC e-MMCTM Version 5.1-compliant embedded NAND flash memory products that feature an enhanced operational temperature range of -40°C to +105°C.

01/12/2017  The global gallium arsenide (GaAs) components market is expected to grow at a CAGR of over 4% during the forecast period, according to TechnavioÂ’s latest report.

01/12/2017  Worldwide semiconductor capital spending is projected to increase 2.9 percent in 2017, to $69.9 billion, according to Gartner, Inc.

01/12/2017  Synopsys, Inc. today announced it has completed its acquisition of certain assets of Forcheck.

01/11/2017  New 900V, 10m? chip enables new improvements in range, battery usage and vehicle design.

01/11/2017  Shift in the use of trusted identities fuels broader adoption of mobile and advanced smart card technology, a greater emphasis on the Cloud and emerging IoT use cases.

01/11/2017  Coupling Wave Solutions, S.A. and STMicroelectronics today announced that they partnered together to reduce time-to-market for high-performance radio frequency (RF) silicon-on-insulator (SOI) designs

01/11/2017  Physicists at the National Institute of Standards and Technology (NIST) have cooled a mechanical object to a temperature lower than previously thought possible, below the so-called "quantum limit."

01/11/2017  Measurement shows potential for building better solar cells by imaging fundamental properties of the material.

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.