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Automating Military Hybrids and Microwave Module Assembly

09/01/2003  Military hybrids and microwave devices are a distinct subset of microelectronics assembly. Because these devices emphasize power, reliability and robustness in harsh operating environments, assembly techniques require a high level of precision, particularly in the areas of dispensing epoxy and handling die.

Design your own ASIC

09/01/2003  The potential of 90 nm application-specific integrated circuit (ASIC) designs is introducing new packaging challenges that threaten the IC designer's ability to take full advantage of this advanced process technology.

Award Winners

09/01/2003 

AP Award Program Sees Another Successful Year

09/01/2003  Innovation again took center stage at Advanced Packaging's 2003 Advanced Packaging Awards Ceremony, held July 16 in conjunction with SEMI and the back-end portion of SEMICON West.

The Revival of Vertical Manufacturing

09/01/2003  A number of years ago when I became involved in electronics manufacturing, many of the large companies that dominated the marketplace, such as IBM, Motorola and Xerox, operated as "vertically integrated" organizations.

Getting your SiP to Market

09/01/2003  There are almost as many definitions of system-in-package (SiP) as there are companies manufacturing them. For the sake of clarity, this article defines SiP as a single package having one or more ICs plus passives with multiple interconnections.

Thermal and Stress Simulations

09/01/2003  To simplify the thermal management task facing customers, every chip released must meet tough internal performance specifications. But it is difficult to determine the thermal performance of a new design without actually building and testing it, which normally does not occur until relatively late in the design cycle.

Meet Demand With Optoelectronics Software

09/01/2003  There was a time when electronics manufacturers focused most of their efforts on developing ways to increase production capacity to meet consumer demand.

M+W Zander subsidiary to build freeze drying facility

08/29/2003  AUG. 29--KIEL, GERMANY--Ferring Pharmaceuticals of, a Ferring BV subsidiary, has placed an order with LSMW GmbHa, a fully-owned subsidiary of M+W Zander Facility Engineering GmbH, to engineer and construct a new turnkey production facility.

Sempermed picked as glove supplier

08/29/2003  AUG. 28--PALM HARBOR, Fla.--Sempermed has been selected to be the exclusive disposable glove supplier to members of the North American Ambulance Alliance (N3A).

Welcome to Nano Reality TV, where the show is mistaken for truth

08/29/2003  The past few months have raised the curtain on the next piece of policy theater. As we saw in the media nanoswarm that followed GreenpeaceÂ’s recent report, itÂ’s easy to deceive the audience with the "nanotech pollutes" line because there is little evidence it does not pollute. This lack of available fact throws scriptwriting responsibilities over to the best manipulators of public opinion, prejudice and fear.

Lancet calls for papers on nanomedicine

08/29/2003  The U.K.-based international medical journal The Lancet, writing that nanoscience offers extraordinary possibilities for medicine, is calling on the medical community to submit articles and reviews on the emerging field.

Elpida, Powerchip sign pact

08/28/2003  August 26, 2003 - Powerchip Semiconductor Corp., Hsinchu, Taiwan, and DRAM JV Elpida Memory, Tokyo, Japan, a DRAM JV between NEC and Hitachi, have extended a previous agreement to exchange foundry services for chip manufacturing processes.

Elpida to absorb NEC facility

08/28/2003  August 26, 2003 - Elpida Memory, Tokyo, Japan, a JV between NEC and Hitachi, plans to take over NEC's production facility in Hiroshima to bolster its position in the DRAM market.

Unaxis consolidates front- and back-end businesses

08/28/2003  August 27, 2003 - To better cope with the cyclical semiconductor industry and improve its position in the global marketplace, Unaxis Corp., Cham, Switzerland, is planning to merge several of its operations under one organizational roof.

Nanotech to take a flying leap off the ivory tower for Chicago event

08/28/2003  Organizers of a new nano conference promise to make this one stand out from the others by emphasizing business and products, rather than research and theory. NanoCommerce 2003 will gather together business leaders from a wide range of industries to talk about how to sell their nanotechnology-enabled products.

MEMSCAP to acquire GalayOr and more cash

08/28/2003  MEMSCAP SA, a France and Silicon Valley-based MEMS designer and manufacturer, plans to acquire Israel-based GalayOr Inc. and raise $3.5 million from its original investors, according to a news release.

Questions surround infection control at Hong Kong hospitals

08/27/2003  AUG. 27--HONG KONG--An outbreak of upper respiratory infections among health workers in Hong Kong has raised questions about infection control measures in hospitals.

Intel to build second facility in China

08/27/2003  AUG. 27--HONG KONG--Chipmaking giant Intel Corp. says it will build a $375 million assembly and test plant in western China that is slated to begin operations in 2005 or 2006.

AMD's purchase of Coatue could boost its memory, signal strategy

08/27/2003  In what could be the first of many buyouts of small-tech memory makers, Advanced Micro Devices purchased molecular memory maker Coatue in June. Neil Gordon, nanotechnology partner at Sygertech and president of the Canadian NanoBusiness Alliance, thinks it could be the first of many such purchases as the semiconductor industry searches for new technologies to power the products of tomorrow.