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Miniscule amounts of impurities in vacuum greatly affecting OLED lifetime

01/03/2017  Reproducibility is a necessity for science but has often eluded researchers studying the lifetime of organic light-emitting diodes (OLEDs).

Imec and Besi demonstrate long-term reliability of Ni-Cu-Ag plated solar modules

01/03/2017  Today, imec (partner in EnergyVille) and BE Semiconductor Industries N.V. (Besi), a manufacturer of assembly equipment for the semiconductor industry, announced that they have demonstrated long-term reliability in five full size 60-cells Nickel/Copper/Silver (Ni/Cu/Ag) plated solar cell modules, confirming the industrial value of this metallization technology.

Industry 4.0: What does it mean to the semiconductor industry?

12/23/2016  Adding intelligence to materials and products facilitates the fully decentralized operations model associated with Industry 4.0.

ESD Alliance reports EDA industry revenue increase for Q3 2016

12/23/2016  The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 7.0 percent for Q3 2016.

Stability challenge in perovskite solar cell technology

12/23/2016  New research reveals intrinsic instability issues of iodine-containing perovskite solar cells.

Sensor sensation

12/22/2016  OIST researchers create a novel sensor capable of measuring both charge and mass of biomolecules with potential applications in healthcare diagnostics.

Advance in intense pulsed light sintering opens door to improved electronics manufacturing

12/22/2016  Faster production of advanced, flexible electronics is among the potential benefits of a discovery by researchers at Oregon State University's College of Engineering.

Public tender offer by TDK subsidiary EPCOS to acquire Tronics successful

12/21/2016  TDK Corporation and Tronics Microsystems SA jointly announced today that the all-cash public tender offer launched by TDKÂ’s wholly-owned subsidiary EPCOS AG (“EPCOS”) was successfully closed on December 14, 2016.

Advances in artificial intelligence, IoT highlight IHS Markit's global technology predictions for 2017

12/21/2016  From artificial intelligence to the Internet of Things (IoT), far-reaching innovations are unfolding in virtually every technology sector around the globe, continuing to change the way consumers, businesses and machines interact while also spurring the next revolution in tech market growth.

New material with ferroelectricity and ferromagnetism may lead to better computer memory

12/21/2016  Scientists at Tokyo Institute of Technology (Tokyo Tech) have demonstrated that ferroelectricity and ferromagnetism coexist at room temperature in thin films of bismuth-iron-cobalt oxide. The research could have implications in the next generation of computer memory and sensors.

Semiconductor materials: restructuring in the supplier base

12/21/2016  Earlier this year, the Nikkei Asian Review (and other sources) reported the exit of Sumitomo Metal Mining (SMM) from the leadframe business.

Detecting fluorocarbons with infrared

12/21/2016  Detection and measurement of fluorocarbons is key to both process control and safety.

Has SOI's turn come around again?

12/21/2016  Analysts see another chance for Silicon-on-Insulator technology, as proponents claim technical and cost advantages for fully-depleted SOI.

MRAM takes center stage at IEDM 2016

12/21/2016  With good data retention and speed, and medium density, MRAM may have advantages for systems which have large amounts of on-chip SRAM.

Improving the accuracy of bump height and coplanarity measurement

12/21/2016  A new approach to bump height measurements uses an interferometric technique to accurately measure bump height and PL thickness.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.

The Connected Experience: A ManufacturerÂ’s Dream?

07/09/2014  Imagine being able to not only track and address equipment degradation in real time, but also analyze patterns in your factoriesÂ’ equipment and address potential issues before they even present a problem. It may sound too good to be true, but MicrosoftÂ’s Sanjay Ravi explained in Wednesday morningÂ’s keynote that this innovation is becoming available now to manufacturers.