08/01/2003 As usual, my carry-on bag was bloated with analyst reports, predictions and prophecies gathered while racing to appointments with equipment manufacturers and contamination control thought leaders at SEMICON West 2003.
08/01/2003 The column "All standards are not created equal..." (CleanRooms, April 2003, pg. 11) only addresses a part of a much bigger issue. I dare say that not only are all standards not created equal, but some may not even be necessary.
08/01/2003 This month I did quite a bit of traveling, while getting to know the readers and advertisers in Advanced Packaging a little better by face-to-face visits.
08/01/2003 In the recent article by Hank Rahe, published in the Life Science section of CleanRooms magazine, the author claims that secondary containment is a must when designing a contamination control system [March 2003, pg. 14].
08/01/2003 I was barely 18 when he plowed through the door of the Respite House, where I was interviewing for a part-time job working with the developmentally disabled.
08/01/2003 Hank Hogan recently wrote a news article for CleanRooms exploring the relatively slow pace of the changeover from Federal Standard (FS) 209E to the newer ISO 14644-1.
08/01/2003 Over the years, most semiconductor cleanrooms have been built with their air filters mounted in the ceiling—a configuration initially referred to as a vertical laminar flow (VLF) installation.
08/01/2003 The continuous push for cost reduction, increased functionality and performance, system compactness, and enhanced quality remain unabated in consumer, communications, defense and medical electronics.
08/01/2003 It appears that past history again may be an indicator that growth is returning to the semiconductor industry. In our cyclic world of semiconductors, an increase in sales for the outsourcing of packaging and test services usually has been an early indicator that the industry has bottomed and a return to growth is on the way.
08/01/2003 Many designers have discovered that the benefits of system-on-chips (SoCs) do not always justify the costs. The challenges of combining digital, analog and RF functions, typically optimized for different process technologies, in a single piece of silicon have proved daunting.
08/01/2003 Much discussion and debate have taken place in engineering circles regarding the 21st century question: "To clean or not to clean?" No-clean flux or cleanable flux? Batch or inline technologies? Open- or closed-loop? Chemical or water-only processes?
08/01/2003 From the advent of the telephone and the world's first radio broadcast to the development of the electronic hearing aid and the cellular phone, technology has transformed the way people use sound at work, home and play.
08/01/2003 The new generations of dynamic random access memory (DRAM) and synchronous dynamic random access memory (SDRAM) technologies are contributing to increased system performance significantly.
07/31/2003 July 31, 2003 - Royal Philips Electronics NV, Amsterdam, The Netherlands, and Advanced Semiconductor Manufacturing Corporation (ASMC) have expanded their joint venture include a new $687 million semiconductor manufacturing facility, according to Dow Jones.
07/31/2003 Paolo Gargini, director of technology strategy at Intel Corp., has high hopes for nanotechnology — and a $4 billion research budget to make those hopes a reality.
Intel expects to perfect 100-nanometer chip features this year, two years ahead of schedule. At its current pace, that number should drop to 22 nanometers by 2015.
07/30/2003 JULY 29--STUTTGART, Germany--M+W Zander - D.I.B. Facility Management GmbH has received the order for the complete technical and infrastructural facility management of the Mahle Group
07/30/2003 JULY 30--BILLERICA, Mass.-Millipore says that its Milli-Q, Direct-Q, Elix, RiOs and Simplicity water purification systems are now listed by Underwriters Laboratories Inc. (UL) and therefore meet UL and C-UL (Canadian) mechanical and electrical safety criteria.
