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2D materials may be brittle

12/21/2016  Molybdenum-diselenide brittle, borophene not.

Air-gaps for finFETs shown at IEDM 2016

12/21/2016  Researchers from IBM and GlobalFoundries will report on the first use of "air-gaps" as part of the dielectric insulation around active gates of "10nm-node" finFETs at the upcoming International Electron Devices Meeting (IEDM) of the IEEE.

High-NA EUV lithography investment

12/21/2016  ASML funds Zeiss for anamorphic >0.5 NA.

The new driver for semiconductor tech

12/21/2016  Over the past 40 years, the electronics industry has gone through three distinct stage or “waves” of evolution.

Toshiba expands line-up of embedded NAND flash memory products for automotive applications

12/20/2016  Sample shipments start from today with mass production scheduled for the second quarter (April to June) of 2017.

Seoul Semiconductor Europe GmbH announces new CEO

12/20/2016  Andreas Weisl (38), former Vice President Europe of Korean LED manufacturer Seoul Semiconductor (SSC), has taken on the position of CEO at Seoul Semiconductor Europe GmbH based Munich, Germany, with effect from November 11, 2016.

Materion Precision Optics acquires gettering capabilities for wafer level processing

12/20/2016  Materion Corporation announced today that its Precision Optics business has acquired the proprietary thin film gettering technology and related intellectual property assets from Integrated Sensing Systems.

STMicroelectronics and Valencell announce collaboration on biometric sensor platform for wearables and IoT

12/20/2016  New scalable development kit integrates ST SensorTile with Valencell's Benchmark biometric sensor system to accelerate smart wearable and IoT product development.

World's smallest radio receiver has building blocks the size of 2 atoms

12/16/2016  Researchers from the Harvard John A. Paulson School of Engineering and Applied Sciences have made the world's smallest radio receiver - built out of an assembly of atomic-scale defects in pink diamonds.

NIST device for detecting subatomic-scale motion may aid robotics, homeland security

12/16/2016  Highly sensitive measuring tool can also be mass-produced.

GLOBALFOUNDRIES expands Partner Program to speed time-to-market of FDX solutions

12/16/2016  GLOBALFOUNDRIES today announced the addition of eight new partners to its growing FDXcelerator Program, including Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Infosys, Mentor Graphics, Rambus, Sasken, Sonics, and QuickLogic.

North American semiconductor equipment industry posts November 2016 book-to-bill ratio of 0.96

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

LEDs and power electronic innovations are converging to handle module-level thermal management

12/15/2016  In 2015, all economic indicators pointed to continued market growth for both industries, power electronics and LED, especially with IGBT modules boosted by EV/HEV industry and general lighting applications, a killer application for LEDs since 2012.

Embedded die: From incubation to high volume production

12/15/2016  Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms.

Toshio Maruyama to receive SEMI Marketing Excellence Award at SEMICON Japan

12/15/2016  SEMI this week announced that Toshio Maruyama has been selected as the 2017 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham.

Researchers work to improve the lifecycle of materials

12/15/2016  When most living creatures get hurt, they can self-heal and recover from the injury. But, when damage occurs to inanimate objects, they don't have that same ability and typically either lose functionality or have their useful lifecycle reduced. Researchers at the Beckman Institute for Advanced Science and Technology are working to change that.

Amkor completes product qualification of SWIFT packaging

12/14/2016  Amkor Technology, Inc. today announced completion of product qualification for its innovative new Silicon Wafer Integrated Fan-Out Technology (SWIFT).

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors