11/21/2016 MACOM Technology Solutions Holdings, Inc., a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, today announced it has entered into a definitive agreement to acquire Applied Micro Circuits Corporation
11/17/2016 The overall utilization rate at fabrication plants (fabs) used for display panel production is expected to reach 90 percent in the fourth quarter of 2016, up 7 percentage points from the same period in the previous year, and up 1 percentage point from the previous quarter.
11/17/2016 Electronics manufacturing executives will examine growth prospects, global industry developments and technology strategy at the SEMI Industry Strategy Symposium (ISS) 2017 to be held January 8-11 at the Ritz-Carlton, Half Moon Bay.
11/17/2016 Qualcomm Incorporated today announced that its subsidiary, Qualcomm Technologies, Inc., and Samsung Electronics Co., Ltd., have extended their decade-long strategic foundry collaboration to manufacture Qualcomm Technologies' latest Snapdragon premium processor, Qualcomm Snapdragon 835, with Samsung's 10nm FinFET process technology.
11/17/2016 Last night at the Printed Electronics USA conference in Santa Clara, Calif., KateevaÂ’s YIELDjet FLEX inkjet printing system was named the winner of the prestigious Technical Development Manufacturing Award.
11/16/2016 The fab, which was completed in record time, realized volume production for customer products merely 20 months after groundbreaking in March of 2015.
11/16/2016 TriLumina Corp., a developer of semiconductor laser illuminators for solid-state LiDAR systems that enable autonomous vehicles and new automotive safety systems, announced that Brian Wong has been named as the company's new President and Chief Executive Officer and as a member of the board of directors.
11/16/2016 Celebrating its 30th anniversary, the largest-ever SEMICON Korea will be held from February 8 to 10, featuring 600 exhibiting companies and an expected 40,000 attendees at COEX, Seoul.
11/15/2016 Synopsys, Inc. today announced it expanded its test and yield analysis solution targeting FinFET-specific defects to enable higher quality testing, repair, diagnostics and yield analysis of advanced 7nm SoCs.
11/15/2016 Semiconductor Manufacturing International Corporation and The Institute of Microelectronics of the Chinese Academy of Sciences announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.
11/11/2016 As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.
11/11/2016 According to the latest market study released by Technavio, the global fan-in wafer-level packaging (WLP) market is expected to reach USD 4.75 billion by 2020, growing at a CAGR of almost 10%.
