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Wafer-scale Encapsulation: Controlling MEMS Packaging Costs

12/01/2002  Microelectromechanical systems (MEMS) technology quickly made the transition from innovative concepts to practical demonstrations and on to early products.

Industry experts speak on WLP and co-design

12/01/2002  The editors of Advanced Packaging and Solid State Technology magazines conducted an exclusive survey of key figures in the semiconductor manufacturing industry. We gathered input on two critical areas of front and backend convergence ? WLP and chip/package co-design. Following is what the industry experts had to say.

Quality System Requirements

12/01/2002  Changes affecting the semiconductor supply chain

Molding Simulation

12/01/2002  Predicting voids and unbalanced mold flow

"Hot-bottom"Ceramic Package

12/01/2002  Revisiting An Old Packaging Approach

The Changing Role of the Materials Supplier

12/01/2002  Electronics packaging materials suppliers traditionally have functioned as developers of continuously evolving formulations that enhance both component and assembly performance and reliability.

SPECIAL STAFF REPORT: An OASIS by the sea at BACUS 2002

11/29/2002  The atmosphere of the 22nd BACUS Photomask Symposium, held recently in Monterey, CA, was oddly upbeat, with a record 156 papers and high attendance, in spite of depressed industry conditions. The mask industry has been hard hit by the slow shift to 130nm and beyond, since most of industry revenue comes from such advanced reticles.

Medrad expands manufacturing to China

11/27/2002  NOV. 27--INDIANOLA, PA--Medrad Inc.'s disposable syringes, which are used medical imaging procedures, have been assembled and shipped from Dong Guan, Guangdong, China, marking the first time Medrad syringes have been manufactured overseas.

Arryx completes $2.1 million third round

11/27/2002  Arryx Inc. said it has completed a $2.1 million third round of funding. The Chicago-based developer of laser-based products for micro and nanoscale technologies said Draper Fisher Jurvetson, a founding investor, took part in the round. The firm did not disclose other participants, which included a private institution and individuals.

Nanotech fund off to slow start; could spur industry investment

11/27/2002  The first mutual fund of publicly traded small tech companies was launched this month, and it got off to a slow start. But industry experts think it has great promise and the timing is right. As for the first day of trading, “It was quite sluggish,” said a portfolio manager. “People are hesitant because they donÂ’t know nanotechnology sufficiently well.”

Surface Logix raises $25M in third round

11/27/2002  Surface Logix Inc. said it has raised $25 million in a two-part, third round of funding.

Plastic Logic secures $3.8 million

11/26/2002  Plastic Logic, a U.K.-based plastic electronics startup, announced a second closing of first-round funding worth $3.8 million.

DARPA taps Radant for RF MEMS project

11/26/2002  Radant MEMS Inc. said it has been selected by the U.S. Defense Advanced Research Projects Agency for a multimillion-dollar radio-frequency (RF) MEMS Improvement Program.

Nat Semi begins construction of semiconductor manufacturing facility in China

11/25/2002  Nov. 25, 2002 - Suzhou, China - National Semiconductor Corp., Santa Clara, CA, has begun construction of its first manufacturing facility in China with groundbreaking ceremonies in Suzhou Industrial Park, the site of the company's planned semiconductor assembly and test facility.

Fairbank Farms recalls 319,763 of ground beef

11/25/2002  NOV. 25--ASHVILLE, N.Y.-- Fairbank Farms is voluntarily recalling approximately 319,763 pounds of ground beef products produced on November 5 and 6, at its facility due here to possible contamination with E. coli O157:H7.

Asyst gets large FOUP order

11/25/2002  NOV. 25--FREMONT, CA--Asyst Technologies, Inc., a provider of semiconductor manufacturing productivity automation, has announced that a leading global silicon wafer manufacturer has placed a large production order for Asyst's G3 front-opening unified pod (FOUP) wafer carriers.

China launches new nano-focused industrial park

11/25/2002  A new industrial park in northeastern China seeks to become an international research, development and marketing center for luminescent and nanotech materials, according to Xinhua, the official Chinese news agency.

Lumera secures $1 million government contract

11/25/2002  Optical networking components developer Lumera Corp., a subsidiary of Microvision Inc., has been awarded a contract extension for approximately $1 million from the U.S. government to continue development of new electro-optic polymer materials for the fabrication of prototype wideband optical modulators, the company said in a news release.

Investors impressed by Agile's agility in the wireless market

11/25/2002  The scientists at Agile Materials & Technologies may be the first to finally commercialize a substance known as BST for use in next-generation communications equipment. Agile has figured out how to combine BST with thin-film sputtering technology and existing CMOS manufacturing techniques to create a new wave of passive, tunable wireless components.

Wyden joins Congressional innovation briefing

11/25/2002  U.S. Sen. Ron Wyden (D-Ore.) has agreed serve as co-chairman of a monthly briefing on cutting-edge science and innovation policy issues for Congress members and their staff.