11/03/2016 Leti, an institute of CEA Tech, and PYXALIS, a French SME specializing in high-performance image sensors, today announced a new technology that lowers readout noise for image sensors down to 0.5 electron noise and dramatically improves low-light image sensing capabilities.
11/03/2016 Newly updated report reviews many of the end-use system applications that are presently impacting and that are forecast to help propel the IC market through 2020.
11/03/2016 Netherlands-based ASML Holding NV, a chip industry equipment provider, and Germany-based Carl Zeiss SMT, a business group of Carl Zeiss AG (ZEISS), have agreed to strengthen their long-standing and successful partnership in the semiconductor lithography business.
11/02/2016 In 2015, more than US$1 billion was invested in ChinaÂ’s advanced packaging ecosystem, announces Yole in its report Status and Prospects for the Advanced Packaging Industry.
11/02/2016 Nowadays, the number of enforceable patents dedicated to miniaturized gas sensors is increasing worldwide, and several companies already stand out by their strong IP position.
11/01/2016 November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics
MooreÂ’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, test, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed, including critical test issues.
11/01/2016 Edwards and GlobalFoundries Singapore were recognized by SingaporeÂ’s National Environment Agency in the Best Practices category at the 2016 Energy Efficiency National Partnership (EENP) Awards.
11/01/2016 Investments in its facilities will enhance current System LSI production to meet the growing demands in the industry for advanced system-on-chip (SoC) products especially for mobile and other electronic devices.
10/31/2016 At the Annual Conference on Magnetism and Magnetic Materials, imec presented breakthrough results supporting the building of technology-relevant majority gates based on spin waves.
10/31/2016 DSI announced today that ON Semiconductor has selected DSIÂ’s Digital Supply Chain Platform (DSCP) to increase stock accuracy and improve worker productivity in its inventory processes across the global supply chain.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
