10/30/2016 Fluoropolymer Electrostatic Discharge (ESD) tubing reduces electrostatic charge to levels below the ignition energy of flammable semiconductor chemicals and maintains chemical purity, ensuring safety and improving process yields.
10/30/2016 Toshiba was the first to commercially implement CMOS image sensors with backside TSV last technologies in 2007. Many of us stated in 2007 that further advances could be obtained by removing the CMOS circuitry to a separate layer and forming a true 3D chip stack, but the technology imple- mentation had to wait while the industry first converted to back side imaging technology.
10/30/2016 IÂ’m delighted to announce that The ConFab, our premier semiconductor manufacturing conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017. For more than 12 years, The ConFab, an invitation-only executive conference, has been the destination for key industry influencers and decision-makers to connect and collab- orate on critical issues.
10/30/2016 Equipment vendors have a lot on their plates now, with memory customers pushing 3D NAND, foundries advancing to the 7 nm node, and 200mm fabs clamoring to come up with hard-to-find tools.
10/28/2016 Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.
10/28/2016 Electrical currents can be now be switched on and off at the smallest conceivable scale enabling a new generation of 'green electronics' with the potential for great impact on the digital economy.
10/27/2016 Analog Devices, Inc. today announced the acquisition of Innovasic Inc., a provider of Deterministic Ethernet semiconductor and software solutions.
10/27/2016 Picosun Oy, a supplier of advanced industrial ALD (Atomic Layer Deposition) technology, now provides its customers production-scale aluminum nitride batch process with superior film thickness uniformity and fast speed.
10/27/2016 November 15, 2016 at 1:00 p.m. ET / Sponsored by Brewer Science
Directed self-assembly (DSA) patterning is one of the primary methods being pursued for future advanced patterning nodes. Since DSAÂ’s initial introduction in the early 2000s, great progress has been made. However, many challenges remain for achieving manufacturing readiness. Key improvements in the areas of materials, defectivity, and process integration are still needed. This webcast will cover published progress to date, review key improvements needed, and discuss new advances in DSA technology. Results from CEA-LETIÂ’s 300-mm lab-to-fab for validation of DSAÂ’s manufacturing readiness will be discussed.
10/27/2016 An electric current will not only heat a hybrid metamaterial, but will also trigger it to change state and fade into the background like a chameleon in what may be the proof-of-concept of the first controllable metamaterial device, or metadevice, according to a team of engineers.
10/27/2016 He will be presented with this achievement award during the GSA Awards Dinner Celebration on Thursday, December 8, 2016, at the Santa Clara Convention Center in Santa Clara, Calif.
10/26/2016 Semiconductor Manufacturing International Corporation and Synopsys, Inc. today announced that it has adopted Synopsys' StarRC product as the standard solution for signoff parasitic extraction for its 28nm process technology.
10/26/2016 Researchers have developed a prototype of a next-generation lithium-sulphur battery which takes its inspiration in part from the cells lining the human intestine. The batteries, if commercially developed, would have five times the energy density of the lithium-ion batteries used in smartphones and other electronics.
10/26/2016 One of the mainstays of the System-on-a-Chip (SoC) market is the continued growth of the 3rd Party Semiconductor Intellectual Property (SIP) market.
10/25/2016 Aura Semiconductor, a provider of high performance analog mixed signal solutions, today announced that it has completed Series A round of equity investment from Bay Area based WRV Capital.
