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Edwards launches new Smart Thermal Management System at SEMICON Europa 2016

10/25/2016  Smart TMS helps semiconductor, flat panel display and solar manufacturers improve their process performance and safety by reducing vacuum/abatement pipework condensation.

Cadence reference flow with digital and signoff tools certified on Samsung's 10nm process technology

10/25/2016  Reference flow enables system and semiconductor companies to accelerate delivery of designs on Samsung's second-generation 10nm process (10LPP).

Synopsys Custom Compiler certified for Samsung's 10nm process technology

10/25/2016  Synopsys, Inc. today announced that its Custom Compiler tool has been certified by Samsung Electronics Co., Ltd. to support their 10-nanometer (nm) LPP (Low Power Plus) process.

Development of a new thermoelectric material for a sustainable society

10/25/2016  The first synthesis of bulk CaMgSi with thermoelectric properties

Making silicon-germanium core fibers a reality

10/25/2016  Laser recrystallization can create functional materials for faster transistors, optical transmission.

3D-printed organ-on-a-chip with integrated sensors

10/24/2016  Harvard University researchers have made the first entirely 3D-printed organ-on-a-chip with integrated sensing.

SEMICON Europa opens tomorrow in Grenoble, France

10/24/2016  SEMICON Europa will open its doors tomorrow, showcasing the latest product, tools, and technologies for advanced microelectronics manufacturing.

ams schedules 2017 multi-project wafer starts for analog foundry customers

10/24/2016  180nm CMOS and HV-CMOS MPW runs are now manufactured in ams' 200mm fabrication facility in Austria.

Messe München and SEMI Europe announce new alliance

10/24/2016  SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.

Ultralow power transistors could function for years without a battery

10/21/2016  A new design for transistors which operate on 'scavenged' energy from their environment could form the basis for devices which function for months or years without a battery, and could be used for wearable or implantable electronics.

New perovskite solar cell design could outperform existing commercial technologies

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

Researchers find way to tune thermal conductivity of 2-D materials

10/21/2016  Researchers have found an unexpected way to control the thermal conductivity of two-dimensional (2-D) materials, which will allow electronics designers to dissipate heat in electronic devices that use these materials.

Semiconductor equipment bookings continue to outpace equipment billings in new book-to-bill report

10/21/2016  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

Avalanche Technology announces the start of volume production of STT-MRAM on 300mm wafers

10/20/2016  Avalanche Technology, Inc., has entered into a manufacturing agreement with Sony Semiconductor Manufacturing Corporation to begin production of it's Spin Transfer Torque Magnetic RAM (STT-MRAM) on 300mm wafers at various advanced geometry nodes.

Raytheon awarded Title III contract to advance its Gallium Nitride technology

10/20/2016  The U.S. Air Force Research Laboratory and the Office of the Secretary of Defense have awarded Raytheon Company [NYSE: RTN] a $14.9M contract to further enhance its process for producing gallium nitride-based semiconductors.

Exploring defects in nanoscale devices for possible quantum computing applications

10/20/2016  Researchers at Tokyo Institute of Technology in collaboration with the University of Cambridge have studied the interaction between microwave fields and electronic defect states inside the oxide layer of field-effect transistors at cryogenic temperatures.

Working under pressure: Diamond micro-anvils with huge pressures will create new materials

10/20/2016  UAB researchers will use pressures greater than those found at the center of the Earth to create as yet unknown new materials.

Scientists find technique to improve carbon superlattices for quantum electronic devices

10/20/2016  In a paradigm shift from conventional electronic devices, exploiting the quantum properties of superlattices holds the promise of developing new technologies.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.