10/13/2016 Researchers at the Nanoscience Center (NSC) of the University of Jyväskylä and BioMediTech (BMT) of the University of Tampere have now demonstrated a method to fabricate electronic devices by using DNA.
10/12/2016 A team of Shanghai Jiao Tong University researchers in China has developed antireflective structures capable of suppressing visible light at different angles of incidence -- with potential for solar cells.
10/12/2016 Scientists with the Energy Department's National Renewable Energy Laboratory (NREL) for the first time discovered how to make perovskite solar cells out of quantum dots and used the new material to convert sunlight to electricity with 10.77 percent efficiency.
10/12/2016 Murata Manufacturing Co., Ltd. and IPDiA S.A. today announced that Murata Electronics Europe B.V., a wholly-owned subsidiary of Murata is about to acquire IPDiA, a 3D silicon capacitor technology developer headquartered in France, and IPDiA will become a subsidiary of Murata.
10/12/2016 Silvaco, Inc., a provider of electronic design automation software and semiconductor IP, today announced that Dr. Raul Camposano has joined Silvaco's Technical Advisory Board (TAB).
10/11/2016 Total wafer demand is expected to return to historical growth rates over the next five years. However, what is uncharacteristic of the past is the wide range of decline and growth that will be logged by specific product categories and technologies.
10/11/2016 Astronics Corporation announced that it has appointed three new independent directors to its Board: Jeffry D. Frisby, Warren C. Johnson and Neil Kim.
10/11/2016 Dual-ion batteries (DIBs) are a new type of battery developed in recent years, typically using graphite as both the cathode and anode material.
10/10/2016 Located in Theale, this new office quadruples the working area and laboratory space to better accommodate the UK team's 90-percent growth since the Murata acquisition in Dec. 2014.
10/10/2016 October 26, 2016 at 1 p.m. ET / Sponsored by Air Products
With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.
10/10/2016 Researchers have designed a device that uses light to manipulate its mechanical properties. The device, which was fabricated using a plasmomechanical metamaterial, operates through a unique mechanism that couples its optical and mechanical resonances, enabling it to oscillate indefinitely using energy absorbed from light.
10/10/2016 Mentor Graphics Corporation today announced that it has acquired Galaxy Semiconductor, a provider of test data analysis and defect reduction software for the semiconductor industry.
10/07/2016 The company announced today that it has leased a former Qualcomm-owned manufacturing facility in Silicon Valley and will relocate its current US headquarters and NFC Innovation Center in the first quarter of 2017.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
07/09/2014 Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.
