Featured Content




Researchers develop DNA-based single-electron electronic devices

10/13/2016  Researchers at the Nanoscience Center (NSC) of the University of Jyväskylä and BioMediTech (BMT) of the University of Tampere have now demonstrated a method to fabricate electronic devices by using DNA.

SEMI announces retirement of president and CEO

10/13/2016  McGuirk will continue to lead SEMI in his current capacity until a successor is appointed.

Cicada wings inspire antireflective surfaces

10/12/2016  A team of Shanghai Jiao Tong University researchers in China has developed antireflective structures capable of suppressing visible light at different angles of incidence -- with potential for solar cells.

Nanoscale confinement leads to new all-inorganic perovskite with exceptional solar cell properties

10/12/2016  Scientists with the Energy Department's National Renewable Energy Laboratory (NREL) for the first time discovered how to make perovskite solar cells out of quantum dots and used the new material to convert sunlight to electricity with 10.77 percent efficiency.

Murata to acquire IPDiA

10/12/2016  Murata Manufacturing Co., Ltd. and IPDiA S.A. today announced that Murata Electronics Europe B.V., a wholly-owned subsidiary of Murata is about to acquire IPDiA, a 3D silicon capacitor technology developer headquartered in France, and IPDiA will become a subsidiary of Murata.

Dr. Raul Camposano joins Silvaco's Technical Advisory Board

10/12/2016  Silvaco, Inc., a provider of electronic design automation software and semiconductor IP, today announced that Dr. Raul Camposano has joined Silvaco's Technical Advisory Board (TAB).

2016 wafer demand grows while semiconductor chip revenue declines, says Semico Research

10/11/2016  Total wafer demand is expected to return to historical growth rates over the next five years. However, what is uncharacteristic of the past is the wide range of decline and growth that will be logged by specific product categories and technologies.

MEMS & Sensors Industry Group reveals Tech Showcase finalists

10/11/2016  MSIG today announced the shortlist of finalists who will compete for the title of winner at this year's event.

Astronics Corporation expands Board of Directors with three new appointments

10/11/2016  Astronics Corporation announced that it has appointed three new independent directors to its Board: Jeffry D. Frisby, Warren C. Johnson and Neil Kim.

A novel battery design for making dual-ion batteries efficient

10/11/2016  Dual-ion batteries (DIBs) are a new type of battery developed in recent years, typically using graphite as both the cathode and anode material.

Flat panel display capital equipment spending surging

10/10/2016  Flat-panel display (FPD) equipment sales are expected to attain their highest sustained three-year level in the history of the industry.

Peregrine Semiconductor moves UK team to larger facility

10/10/2016  Located in Theale, this new office quadruples the working area and laboratory space to better accommodate the UK team's 90-percent growth since the Murata acquisition in Dec. 2014.

Heterogeneous Integration: An Emerging Trend for Next Generation Microelectronic Devices and a Tremendous Opportunity for Advanced Packaging

10/10/2016  October 26, 2016 at 1 p.m. ET / Sponsored by Air Products

With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.

Metamaterial uses light to control its motion

10/10/2016  Researchers have designed a device that uses light to manipulate its mechanical properties. The device, which was fabricated using a plasmomechanical metamaterial, operates through a unique mechanism that couples its optical and mechanical resonances, enabling it to oscillate indefinitely using energy absorbed from light.

Mentor Graphics acquires Galaxy Semiconductor

10/10/2016  Mentor Graphics Corporation today announced that it has acquired Galaxy Semiconductor, a provider of test data analysis and defect reduction software for the semiconductor industry.

Thinfilm secures fabrication facility in Silicon Valley to house new roll-to-roll manufacturing line

10/07/2016  The company announced today that it has leased a former Qualcomm-owned manufacturing facility in Silicon Valley and will relocate its current US headquarters and NFC Innovation Center in the first quarter of 2017.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.