09/26/2016 EV Group today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market.
09/26/2016 The advanced semiconductor summit will take place on 23-25 January, 2017 at Minatec in Grenoble, France, with the theme "European 3D Summit 2017 – Creating High Density Systems."
09/23/2016 The Peter Brody Prize will be awarded to a young researcher under age 40 who has made outstanding contributions in innovating the design and enhancing the performance of active matrix addressed information displays.
09/23/2016 For the first time, the NIST researchers have measured the transfer of motion through the contacting parts of a microelectromechanical system at nanometer and microradian scales.
09/23/2016 Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. today jointly announced that they have entered into a definitive merger agreement under which a consortium led by Shanhai Capital will acquire all of the outstanding shares of Analogix for over $500 million.
09/22/2016 Synopsys, Inc. today announced a collaboration with TSMC to complete the certification for its 16-nanometer (nm) FinFET Compact (16FFC) process for a suite of Synopsys' digital, custom and signoff tools from the Galaxy Design Platform.
09/22/2016 The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from the University of Chicago and the University of Michigan in recognition of their outstanding contributions to semiconductor research.
09/22/2016 The bill of materials (BOM) for an iPhone 7 equipped with 32 gigabytes (GB) of NAND flash memory carries $219.80 in bill of materials costs, according to a preliminary estimate from IHS Markit.
09/21/2016 Since the novel inkjet printing solution debuted in manufacturing in 2014, the company has secured the vast majority of available TFE orders.
09/21/2016 The World Semiconductor Council (WSC) is comprised of the semiconductor industry associations (SIAs) of the United States, Korea, Japan, Europe, China and Chinese Taipei. Its goal is to promote international cooperation in the semiconductor sector in order to facilitate the healthy growth of the industry from a long-term, global perspective.
09/21/2016 As advanced device manufacturers identify needs for new and additional CMP steps, new slurry solutions can deliver exceptional planarization and defectivity within a stable CMP process.
09/21/2016 Key features of the cell structure, design and integration of the Micron 3D 32L FG-NAND device are discussed, and compared with SamsungÂ’s 32L and 48L V-NAND device.
09/21/2016 In-the-know attendees at SEMICON West at a Thursday morning working breakfast heard from executives representing the worldÂ’s leading memory fabs discuss manufacturing challenges at the 4th annual Entegris Yield Forum.
09/21/2016 At the 2016 ECTC Conference, TSMC discussed their UFI (UBM-Free Integration) Fan-In WLCSP technology which they claim enables large die fine pitch packages.
09/21/2016 The semiconductor industry is changing in some big ways. Demand for PCs and mobile devices – once the main drivers of growth – has slowed.
09/21/2016 Applied Materials, Inc. today introduced the display industry's first high-resolution inline e-beam review (EBR) system, increasing the speed at which manufacturers of OLED and UHD LCD screens can achieve optimum yields and bring new display concepts to market.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
