09/06/2016 ZEISS introduces the new ZEISS ForTune system for photomask tuning. With its latest optical design, it takes two main mask tuning processes to the next level in terms of efficiency, accuracy and throughput. The first tool has already been delivered to the first customer.
09/06/2016 Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016.
09/02/2016 September 22, 2016 at 1:00 p.m. ET / Sponsored by Edwards
The semiconductor industry’s response to perfluorinated compounds PFCs started in 1994 when DuPont, the supplier of the primary gas used in CVD chamber cleans, C2F6, issued a sales policy restricting sales after 12/31/96 “…only to those applications that contain and either recover or destroy” C2F6 subsequent to use. The sales policy started an industry effort to understand potential impacts of all fluorinated greenhouse gases used in semiconductor manufacturing and to develop methods to estimate and reduce emissions. The industry has worked on a global basis via the World Semiconductor Council to develop common PFC metrics, measurement methodologies and approaches to reduce emissions. Preferring a pollution prevention approach, the industry and its suppliers have evaluated and implemented when feasible process optimization, gas substitution, capture/recycle and abatement. The WSC also set a goal to reduce absolute PFC emissions by 10% from baseline levels by 2010. The WSC exceeded the 2010 goal, achieving a 32% reduction, largely by replacing carbon based PFC chamber cleaning gases with NF3 in new process equipment, optimizing processes to reduce gas consumption, and using alternative chemistries and installing abatement where feasible. The new WSC2020 target calls for the implementation of best practices to further reduce normalized emissions in 2020 by 30% from the 2010 aggregated baseline. How do the semiconductor industry’s greenhouse gas emissions compare to other sectors, what data uncertainties exist, and what can be done to cost effectively achieve further emissions reductions?
09/02/2016 Cabot Microelectronics Corporation announced the appointment of Thomas F. Kelly, Vice President, Corporate Development, which is effective as of September 6, 2016.
09/02/2016 Technavio analysts forecast the global radio frequency (RF) IC market to grow at a CAGR of nearly 12% during the forecast period, according to their latest report.
09/02/2016 Iowa State engineers have led development of a laser-treatment process that allows them to use printed graphene for electric circuits and electrodes -- even on paper and other fragile surfaces. The technology could lead to many real-world, low-cost applications for printed graphene electronics, including sensors, fuel cells and medical devices.
09/02/2016 The Semiconductor Industry Association today announced more than a dozen semiconductor industry icons, leaders, and founders will come together at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose to celebrate the 25th anniversary of the Robert N. Noyce Award, the industry's highest honor.
09/01/2016 Two scientists at the University of Central Florida have discovered how to get a solid material to act like a liquid without actually turning it into liquid, potentially opening a new world of possibilities for the electronic, optics and computing industries.
09/01/2016 For many years, the ATE industry has been challenged with controlling the cost of both production and development test by implementing innovative approaches and employing clever strategies (e.g., multi-site test implementation, DFT, etc.) to make “ends” meet, so to speak.
09/01/2016 SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.
September 14, 2016 at 1 p.m. ET/ Sponsored by Air Products
For a semiconductor technology node, the BEOL definition must support minimal parasitic impact to technology, sufficient reliability, required dimensional scaling from previous nodes for standard cell and custom logic requirements, and high yielding/low cost integration schemes. This webcast will discuss the key BEOL elements and innovations in these areas for the 7nm nodes and beyond. The individual elements are often in conflict with each other, but must be considered in unison to determine the overall best definition.
08/31/2016 The global market for gallium nitride (GaN) semiconductor devices is largely consolidated, with the top four companies commanding a share of over 65% of the overall market in 2015, states Transparency Market Research (TMR) in a new report.
08/31/2016 Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, today announced that NXP Semiconductors has signed an agreement to participate in multiple SRC research initiatives.
08/30/2016 Electron anions impart unconventional properties in a unique cement semiconductor for potentials uses in industrial catalysts and flat panel displays.
