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Will fan-out packaging be sustainable long-term?

08/23/2016  2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC, changed the game and may create a trend of acceptance of Fan-Out packages

Microsemi announces engineering scholarship program with University of Limerick

08/23/2016  Microsemi Corporation today announced it is renewing its current 50,000 euros scholarship program for University of Limerick engineering students living in County Clare, where the company has its European headquarters in Ennis, Ireland.

Peregrine Semiconductor and Aemulus collaborate to advance high frequency testing

08/23/2016  Aemulus, a developer of automated test equipment (ATE) solutions, and Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator), announce their strategic partnership in the development of a new microwave frequency tester.

Hua Hong Semiconductor taps potential of international MCU markets

08/22/2016  Hua Hong Semiconductor Limited, a global pure-play 200mm foundry, today announced that its shipment of microcontroller (MCU) chips in the first half of 2016 grew to 1.2 billion, a year-on-year increase of 50%, breaking the historical record.

China's semiconductor industry worth $157.66B by 2020

08/22/2016  The China semiconductor industry is expected to reach $157.66 billion by 2020, at a CAGR of 12.8% between 2016 and 2020.

Lori Knowlton joins Silicon Labs as Chief People Officer

08/22/2016  Silicon Labs (NASDAQ: SLAB), a provider of silicon, software and solutions for a smarter, more connected world, today named Lori Knowlton as Senior Vice President and Chief People Officer (CPO).

Automotive MEMS market to thrive; China and India project lucrative growth

08/22/2016  A few major brands in the automotive MEMS market witnessed a regulatory blow in 2014-15, resulting in passive market dynamics. However, the market has recovered rapidly and is currently growing at a significant pace, according to new research recently published by Future Market Insights.

New theory could lead to new generation of energy friendly optoelectronics

08/22/2016  Researchers at Queen's University Belfast and ETH Zurich, Switzerland, have created a new theoretical framework which could help physicists and device engineers design better optoelectronics.

Innodisk unveils its next-generation M2DOM

08/19/2016  Innodisk unveiled its Next Generation innovation in flash storage design technology last week during its VIP product launch at the Hyatt Hotel in Santa Clara, CA.

Applied Materials announces record results

08/19/2016  Applied Materials, Inc. today reported results for its third quarter ended July 31, 2016.

Natural scale caterpillar soft robot is powered and controlled with light

08/18/2016  Researchers at the Faculty of Physics at the University of Warsaw, using the liquid crystal elastomer technology, originally developed in the LENS Institute in Florence, demonstrated a bioinspired micro-robot capable of mimicking caterpillar gaits in natural scale.

Global silicon photonics market to grow at a CAGR of over 48% through 2020

08/18/2016  Technavio analysts forecast the global silicon photonics market to grow at an impressive CAGR of over 48% during the forecast period, according to their latest report.

IHS Markit releases ranking of Top LED suppliers

08/18/2016  IHS Markit released its annual 2015 revenue-share ranking of the top LED suppliers in backlighting, automotive, lighting and other applications.

Toshiba introduces high-voltage MOSFET family for efficient, high-speed switching

08/18/2016  Toshiba America Electronic Components, Inc. today announced a new lineup of ultra-efficient, high-speed, high-voltage MOSFETs for switching voltage regulator designs.

KLA-Tencor announces new suite of reticle inspection technologies

08/17/2016  Today, KLA-Tencor Corporation (NASDAQ: KLAC) introduced three advanced reticle inspection systems that address 10nm and below mask technologies: the Teron 640, Teron SL655 and Reticle Decision Center (RDC).

New method to identify microscopic failure

08/17/2016  The Autonomous Materials Systems (AMS) Group at the Beckman Institute for Advanced Science and Technology has recently found a new way to identify microscopic damage in polymers and composite materials before total failure occurs.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.