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New method for making green LEDs enhances their efficiency and brightness

07/29/2016  Researchers at the University of Illinois at Urbana Champaign have developed a new method for making brighter and more efficient green light-emitting diodes.

STMicroelectronics acquires ams' NFC and RFID reader assets

07/29/2016  STMicroelectronics today announced that it has acquired ams' assets related to NFC1 and RFID2 reader business

Busch to open a new service center in Austin, Texas

07/28/2016  Busch, LLC this week announced plans to build a new 44,000 sq. ft. building in Austin, Texas.

Sustainable sensors to detect, predict muscle fatigue

07/28/2016  A new study published in the ECS Journal of Solid State Science and Technology aims to take advantage of sweat's trove of medical information through the development of a sustainable, wearable sensor to detect lactate levels in your perspiration.

SJSemi and Qualcomm announce mass production of 14nm wafer bumping technology

07/28/2016  SJ Semiconductor Corp. and Qualcomm Technologies, Inc. jointly announced that SJSemi has begun mass production of 14nm wafer bumping for Qualcomm Technologies.

New nontoxic process promises larger ultrathin sheets of 2-D nanomaterials

07/27/2016  A team of scientists led by the Department of Energy's Oak Ridge National Laboratory has developed a novel way to produce two-dimensional nanosheets by separating bulk materials with nontoxic liquid nitrogen.

Utah and Minnesota engineers discover highly conductive materials for more efficient electronics

07/27/2016  Engineers from the University of Utah and the University of Minnesota have discovered that interfacing two particular oxide-based materials makes them highly conductive, a boon for future electronics that could result in much more power-efficient laptops, electric cars and home appliances that also don't need cumbersome power supplies.

Second quarter 2016 silicon wafer shipments increase quarter-over-quarter; sets a new record

07/27/2016  Worldwide silicon wafer area shipments increased during the second quarter 2016 when compared to first quarter 2016 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Chemical etching method helps transistors stand tall

07/26/2016  University of Illinois researchers have developed a way to etch very tall, narrow finFETs, a type of transistor that forms a tall semiconductor "fin" for the current to travel over. The etching technique addresses many problems in trying to create 3-D devices, typically done now by stacking layers or carving out structures from a thicker semiconductor wafer.

Peregrine Semiconductor announces new VP General Manager

07/26/2016  Peregrine Semiconductor Corp. today announced the promotion of Takaki Murata to vice president and general manager of the high performance analog (HPA) business unit.

A*STAR'S IME kicks off consortia to develop packaging solutions for IoT applications

07/26/2016  Innovative capabilities developed will lead to higher power efficiency and lower costs for MEMS and silicon photonics devices.

Evolving flip-chip technology boosting markets

07/25/2016  New levels of performance of electronics technology have been enabled by flip-chip technology, fueling the growth of global markets for semiconductors, electronic devices, and a host of industrial and consumer products.

Applied Materials appoints Judy Bruner to Board of Directors

07/25/2016  Applied Materials, Inc. today announced the appointment of Judy Bruner to serve on its Board of Directors. Ms. Bruner has also been appointed to serve as a member of the Audit Committee of the Board.

Ultra-flat circuits will have unique properties

07/25/2016  Rice University lab studies 2-D hybrids to see how they differ from common electronics.

Worldwide semiconductor capital spending to decline 0.7% in 2016, Gartner reports

07/22/2016  Worldwide semiconductor capital spending is projected to decline 0.7 percent in 2016, to $64.3 billion, according to Gartner, Inc. This is up from the estimated 2 percent decline in Gartner's previous quarterly forecast.

Registration open with new exhibition features at SEMICON Europa

07/22/2016  Today SEMI announced registration opened for Europe's largest electronics manufacturing exhibition, SEMICON Europa (25-26 October) in Grenoble.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.