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Micron provides statement on U.S. Department of Justice indictments relating to theft of Micron trade secrets

11/02/2018  Micron Technology, Inc. today received the announcement from the U.S. Department of Justice that on Nov. 1, 2018, it had issued indictments against United Microelectronics Corporation (UMC), Fujian Jinhua Integrated Circuit (Jinhua) and three former employees of Micron's Taiwan unit for conspiracy to commit trade secret theft, economic espionage and related crimes.

Exploring the structure and properties of new graphene-like polymers

11/02/2018  A team of scientists from Siberian Federal University (SibFU) together with foreign colleagues described the structural and physical properties of a group of two-dimensional materials based on polycyclic molecules called circulenes.

2D magnetism: Atom-thick platforms for energy, information and computing research

11/01/2018  Scientists say the tiny 'spins' of electrons show potential to one day support next-generation innovations in many fields.

Rudolph Technologies releases NovusEdge System for edge, notch and backside inspection of unpatterned wafers

11/01/2018  New system combines high sensitivity, repeatability and throughput to deliver the industry's best performance and cost-of-ownership for inspection of critical wafer zones.

MagnaChip Semiconductor appoints semiconductor veteran Jeong Ki Min as Chief of Strategic Planning

11/01/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the appointment of Jeong Ki Min to the newly created position of Chief of Strategic Planning

GSA announces new leadership and multiple market initiatives

10/31/2018  The Global Semiconductor Alliance (GSA) Board of Directors has appointed Dr. Lisa Su, President and Chief Executive Officer of Advanced Micro Devices, Inc. (AMD), as Chair of GSA Board of Directors and Simon Segars, Chief Executive Officer of Arm, as the Vice Chair.

Renesas Electronics announces absorption-type merger with consolidated subsidiary

10/31/2018  Renesas Electronics Corporation today announced that it has resolved at the Meeting of Board of Directors held on October 31, 2018 to consolidate its wholly-owned subsidiary Renesas Semiconductor Package & Test Solutions Co, Ltd.

Innodisk bringing the next-generation NAND flash to the industrial embedded market

10/31/2018  Innodisk is launching its industrial-grade 3D NAND SSD series, making the newest NAND flash technology available for the challenging requirements of embedded and industrial applications.

Netronome announces open chiplet architecture for advanced SoC designs

10/31/2018  Netronome today announced an open architecture for domain-specific accelerators designed to significantly reduce the burgeoning cost of silicon development as demanded by modern data center server, edge computing and automotive applications.

Tests show integrated quantum chip operations possible

10/31/2018  For the first time, an Australian team has combined 2 fundamental quantum techniques on an integrated silicon platform, confirming the promise silicon -- the basis of all modern computer chips -- for quantum computing.

Ultrasensitive toxic gas detector

10/31/2018  In a paper published in NANO, researchers from the School of Microelectronics in Tianjin University have discovered a two-step sputtering and subsequent annealing treatment method to prepare vertically aligned WO3-CuO core-shell nanorod arrays which can detect toxic NH3 gas.

Innodisk enters alliance with subsidiaries and partners to bring AIoT into the spotlight

10/30/2018  Innodisk, along with partners and its four subsidiaries, are expanding into to the sectors where IoT intersects with AI to reach untapped potential.

pSemi announces frequency extension and volume production of the 55 GHz Digital Step Attenuator (DSA)

10/30/2018  This mmWave product is the world's first single-chip silicon-on-insulator (SOI) DSA to support the entire 9 kHz to 55 GHz frequency range.

German research institute drives flexible electronics innovations

10/30/2018  SEMI spoke with Prof. Christoph Kutter, executive director, Fraunhofer EMFT, about trends and innovations in flexible hybrid electronics ahead of his presentation at the 2018 FLEX Europe - Be Flexible conference at SEMICON Europa 2018, 13-16, November 2018, in Munich, Germany.

A solar cell that does double duty for renewable energy

10/30/2018  Researchers develop an artificial photosynthesis system that generates hydrogen fuel and electricity at the same time.

Synopsys advances Test Fusion technology with test points to reduce manufacturing costs and boost quality

10/29/2018  Accelerates achieving test goals while meeting power, performance, and area targets.

New chip measures multiple cellular responses to speed drug discovery

10/29/2018  Researchers from the Georgia Institute of Technology have designed a cellular interfacing array using low-cost electronics that measures multiple cellular properties and responses in real time.

SEMI Europe supports joint call to candidates for 2019 European elections

10/29/2018  SEMI Europe today confirmed its support for the joint call to future Members of the European Parliament to put industry at the core of the European Union's future.

SEMI shares industry feedback on RoHS review roadmap with European Commission

10/26/2018  SEMI recently shared industry feedback with the European Commission on the roadmap for reviewing RoHS (the Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment).

Nanotubes may give the world better batteries

10/26/2018  Rice U. scientists' method quenches lithium metal dendrites in batteries that charge faster, last longer.