07/15/2016 Toshiba Corporation and Western Digital Corporation today celebrated the opening of the New Fab 2 semiconductor fabrication facility located in Yokkaichi, Mie Prefecture, Japan.
07/15/2016 A collaboration of researchers from Kumamoto, Yamaguchi, and Osaka Universities in Japan have discovered a new method of drastically changing the color and fluorescence of a particular compound using only oxygen (O2) and hydrogen (H2) gases.
07/15/2016 Compared to similar aluminum gallium arsenide/gallium arsenide HEMTs, the gallium nitride-based HEMTs are ten times more tolerant of radiation-induced displacement damage.
07/15/2016 Materials researchers at North Carolina State University have fine-tuned a technique that enables them to apply precisely controlled silica coatings to quantum dot nanorods in a day - up to 21 times faster than previous methods.
07/15/2016 Applied Materials has disclosed commercial availability of new Selectra selective etch twin-chamber hardware for the companyÂ’s high-volume manufacturing (HVM) Producer platform.
07/15/2016 At the ECTC conference in May, in the “Advances in Fan Out Packaging” session, Matt Lueck of RTI International discussed the results of their joint program with X-Celeprint.
07/14/2016 Infineon Technologies AG and Cree, Inc. announced today that Infineon has entered into a definitive agreement to acquire the Wolfspeed Power and RF division of Cree.
07/14/2016 NSTAR Global Services is now offering facilities management services for operations and maintenance (O&M) of installed OEM facility equipment or previously constructed systems that support fab operations in high-tech industries.
07/14/2016 Busch LLC has launched a new program where, at key sites around the world, they have the ability to re-manufacture any major brand of vacuum pump, including high vacuum turbos and cryos.
07/13/2016 Wenge Yang of Entegris spoke with the Show Daily about major trends in High Volume Manufacturing (HVM), and about the topics that will be discussed in the Entegris Yield Breakfast Forum “Yield Enhancement Challenges in Today’s Memory IC Production” happening Thursday morning, July 14.
07/13/2016 Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.
07/13/2016 SEMI honored four industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
