07/13/2016 Leti, an institute of CEA Tech, and the Korea Institute of Science and Technology (KIST) today announced an agreement to jointly explore a variety of technologies, including monolithic 3D, neuromorphic architectures, non-volatile 3D memory, spintronics and ultra-low power semiconductors.
07/13/2016 Kateeva is out to change the way displays are being made, and during TuesdayÂ’s Silicon Innovation Forum keynote, Kateeva President and COO Conor Madigan, PhD, laid out how their YIELDJet inkjet system is making that happen.
07/12/2016 Semiconductor manufacturers and their suppliers – both process tool vendors and providers of sub-fab systems – are looking to an open-source industrial networking methodology, EtherCAT, developed by Beckhoff Automation to address the increasingly stringent control requirements of emerging high-precision processes.
07/12/2016 SEMI today announced that Jon D. Kemp, president of DuPont Electronics & Communications, and Tadahiro Suhara, president of SCREEN Semiconductor Solutions Co., Ltd., were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.
07/12/2016 MEMS & Sensors Industry Group (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors, flexible substrates and semiconductors in the Internet of Things (IoT) at SEMICON West on July 13, 2016.
07/12/2016 Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.?
07/12/2016 SEMI projects that the worldwide semiconductor equipment market will be flat this year and will rebound in 2017 according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.
07/11/2016 Synopsys' Process Explorer and Raphael accurately simulate parasitic resistance of alternative metals and liner-barrier materials at the 7nm node and beyond.
07/11/2016 Applied Materials, Inc. today announced its next-generation e-beam inspection system is delivering the highest resolution and image quality at the fastest throughput to leading foundry, logic, DRAM and 3D NAND customers as they move to advanced nodes.
07/08/2016 3D-Micromac AG announced that its microDICE laser micromachining system has been adopted by a major industrial manufacturer for volume production of high-power diodes.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
07/09/2014 Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.
