Featured Content




Leti and Korea Institute of Science and Technology to collaborate on key growth areas for growing digital era

07/13/2016  Leti, an institute of CEA Tech, and the Korea Institute of Science and Technology (KIST) today announced an agreement to jointly explore a variety of technologies, including monolithic 3D, neuromorphic architectures, non-volatile 3D memory, spintronics and ultra-low power semiconductors.

Kateeva: Enabling OLED success

07/13/2016  Kateeva is out to change the way displays are being made, and during TuesdayÂ’s Silicon Innovation Forum keynote, Kateeva President and COO Conor Madigan, PhD, laid out how their YIELDJet inkjet system is making that happen.

Nitrous oxide no laughing matter

07/13/2016  N2O, or Nitrous Oxide, also known as laughing gas, is a weak anesthetic gas that has been in use since the late 18th century.

SEMICON West Day 2: Don't Miss

07/13/2016  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

Better networking with open EtherCAT

07/12/2016  Semiconductor manufacturers and their suppliers – both process tool vendors and providers of sub-fab systems – are looking to an open-source industrial networking methodology, EtherCAT, developed by Beckhoff Automation to address the increasingly stringent control requirements of emerging high-precision processes.

A new age of smart manufacturing underway

07/12/2016  A major theme at SEMICON West 2016 is Smart Manufacturing, a.k.a. Industry 4.0 and Industrial IoT (IIoT).

SEMI announces results of board elections and leadership appointments

07/12/2016  SEMI today announced that Jon D. Kemp, president of DuPont Electronics & Communications, and Tadahiro Suhara, president of SCREEN Semiconductor Solutions Co., Ltd., were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

Collaboration in MEMS, sensors and ICs

07/12/2016  MEMS & Sensors Industry Group (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors, flexible substrates and semiconductors in the Internet of Things (IoT) at SEMICON West on July 13, 2016.

Leti develops 3D network-on-chip to improve high-performance computing

07/12/2016  Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.?

Chip equipment spending: SEMI forecasts flat 2016, rebound in 2017

07/12/2016  SEMI projects that the worldwide semiconductor equipment market will be flat this year and will rebound in 2017 according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

Imec and Synopsys collaborate on interconnect resistivity model

07/11/2016  Synopsys' Process Explorer and Raphael accurately simulate parasitic resistance of alternative metals and liner-barrier materials at the 7nm node and beyond.

Rudolph Technologies announces new Clearfind technology for advanced packaging inspection

07/11/2016  Clearfind technology sees organic defects that often escape detection with conventional white-light inspection technologies.

AppliedMicro adopting TSMC 7nm finFET process technology

07/11/2016  AppliedMicro's innovative silicon products enabled by TSMC's advanced technology.

EV Group rolls out automated metrology system for advanced packaging, MEMS manufacturing

07/11/2016  EV Group (EVG) today introduced the EVG50 automated metrology system.

Applied Materials' next-generation e-beam inspection system provides industry's highest resolution

07/11/2016  Applied Materials, Inc. today announced its next-generation e-beam inspection system is delivering the highest resolution and image quality at the fastest throughput to leading foundry, logic, DRAM and 3D NAND customers as they move to advanced nodes.

3D-Micromac releases new laser micromachining solution to volume semiconductor wafer and power device processing

07/08/2016  3D-Micromac AG announced that its microDICE laser micromachining system has been adopted by a major industrial manufacturer for volume production of high-power diodes.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.