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TECHCET 2016 forecast: $1.39B in photoresists, $680M in extensions

07/08/2016  Photoresist manufacturers had reason to smile as fiscal 2015 closed, with sales growing nicely to $1.37B, a 6.2% increase over 2014.

Imec announces the opening of imec Florida

07/08/2016  Imec, a nanoelectronics research center, today announced the opening of imec Florida, a new entity focusing on photonics and high-speed electronics IC design based in Osceola, Florida.

IC Insights lowers 2016 semiconductor market forecast to -1%

07/08/2016  Weak global economy and poor DRAM market to drag down growth this year.

Gigaphoton's EUV light source achieves 250W output at 4.0% conversion efficiency

07/07/2016  Gigaphoton Inc. has announced success in achieving 250W light output at 4.0% conversion efficiency with a Laser-Produced Plasma (LPP) light source prototype for EUV scanners, which the company is currently engaged in developing.

Lattice Semiconductor announces appointment of Brian Beattie to Board of Directors

07/07/2016  Lattice Semiconductor Corporation today announced that its Board of Directors has appointed Brian Beattie to the CompanyÂ’s Board of Directors and Audit Committee.

Sector shake-up as the hype shifts in the $30B wearables market

07/07/2016  With hype around some of the core wearable technology sectors beginning to wane, IDTechEx have released their latest analysis of this diverse and growing industry in their brand new report Wearable Technology 2016-2026.

Rising number of fabless semiconductor companies, test houses to augment chip handler market

07/07/2016  According to the latest market research report by Technavio, the semiconductor chip handler market is expected to grow at a CAGR of over 4% until 2020.

Dr. Cheryl L. Shavers elected to Mentor Graphics Board of Directors

07/07/2016  Mentor Graphics Corp. today announced that on June 15, 2016, the company's shareholders elected Dr. Cheryl L. Shavers to the company's board of directors.

Nova and Leti collaborate to enhance process control schemes for advanced lithography

07/07/2016  Leti, an institute of CEA Tech, and Nova Measuring Instruments announced today a joint program to develop innovative metrology methods to enable leading-edge process control solutions for multi e-beam and directed self-assembly (DSA) advanced lithography techniques.

Pfeiffer Vacuum introduces HiPace 2800 turbopump for ion implantation applications

07/06/2016  Pfeiffer Vacuum has introduced the HiPace 2800 IT turbopump that is designed for ion implantation applications.

EV Group expands high-vacuum wafer bonding capabilities of EVG ComBond platform

07/06/2016  EV Group (EVG) today introduced new capabilities on the EVG ComBond automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

07/06/2016  XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.

Integrated trio of 2-D nanomaterials unlocks graphene electronics applications

07/05/2016  Voltage-controlled oscillator developed at UC Riverside could be used in thousands of applications from computers to wearable technologies.

Global semiconductor sales up slightly in May

07/05/2016  Sales increase 0.4 percent compared to April, decrease 7.7 percent year-to-year.

Plasma-Therm acquires Nano Etch Systems Inc.

07/05/2016  Plasma-Therm, a supplier of wafer process technology solutions to specialty semiconductor and nanotechnology markets, has acquired Nano Etch Systems Inc. of California, a developer of ion beam etch (IBE) and ion beam deposition (IBD) systems.

IoT and mobile devices: Big market opportunities but more challenges towards security threats

07/05/2016  Assuring IoT security will require strategies to manage the entire value and supply chains.

Flawless Execution at Fairchild: How Change to Modern MES Enables Agility, Quality and Productivity

07/01/2016 

August 9, 2016 at 1 PM ET / Sponsored by Siemens

In this high-pressure environment, leading semiconductor companies are swapping out older manufacturing executions systems (MES) for modern MES. Surprised? True, the perceived risk of changing out MES in a semiconductor facility is high. Yet companies have done it with great success and enormous business benefits. Fairchild Semiconductor’s positive experiences as it strives for quality, on-time delivery, new product introduction success, improved productivity and quality are indicative. In just one year, Fairchild switched out aging systems for a new MES at a plant in China – and the following month, they got it up at a second plant. Learn what they did to ensure the change happened quickly and without a hitch. In addition to this case study, you’ll hear from a leading industry analyst who has interviewed dozens of people from semiconductor companies that have succeeded with the move to modern MES.

Kulicke & Soffa joins Chip-on-Wafer Consortium II

07/01/2016  Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC), a designer and manufacturer of semiconductor and LED assembly equipment, has joined A*STARÂ’s Institute of Microelectronics (IME)Â’s Chip-on-Wafer Consortium II, together with other major industry players.

SUSS MicroTec announces new Mask Aligner series MA/BA Gen4

07/01/2016  SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor industry and related markets, announced the launch of the MA/BA Gen4 series today.

The switch that could double USB memory

07/01/2016  Scientists at Hokkaido University have developed a device that employs both magnetic and electronic signals, which could provide twice the storage capacity of conventional memory devices, such as USB flash drives.