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AMICRA to provide precision die attach system to Fabrinet in Silicon Valley

07/01/2016  AMICRA Microtechnologies, a German-based vendor of advanced back-end assembly processing equipment for advanced packaging applications, has received an order for the AFC Plus System from Fabrinet West.

Electronic gases market undergoing major shifts

06/30/2016  Techcet forecasts $3.9B gas business for 2016.

SEMI Strategic Materials Conference delivers demand drivers for new device and packaging materials

06/30/2016  The Strategic Materials Conference (SMC 2016), focusing on "Scaling Challenges: The Future of Materials and Packaging," will be held September 20-21, at the Computer History Museum in Mountain View, Calif.

Gartner reports India PC shipments declined 7.4% in first quarter of 2016

06/30/2016  PC shipments in India totalled nearly 2 million units in the first quarter of 2016, a 7.4 percent decrease over the first quarter of 2015, according to Gartner, Inc.

A*STAR'S IME launches Chip-On-Wafer Consortium II and Cost Effective Interposer Consortium

06/30/2016  A*STARÂ’s Institute of Microelectronics (IME) has partnered semiconductor companies to develop cost-effective solutions in 2.5D and 3D wafer-level integrated circuit (IC) packaging.

HITRS roadmap aims to integrate photonic devices in SiP

06/29/2016  A new roadmap, the Heterogeneous Integration Technology Roadmap for Semiconductors (HITRS), aims to integrate fast optical communication made possible with photonic devices.

Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

06/29/2016  July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

ALLVIA launches new product lines for Through Glass Vias and Through Quartz Vias

06/29/2016  ALLVIA, Inc. has expanded its capacity into glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers.

Amkor opens MEMS packaging line in China

06/29/2016  Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. today announced it is ramping up a new MEMS and sensor packaging line at its facility in Shanghai.

Tiniest imperfections make big impacts in nano-patterned materials

06/28/2016  A Clarkson University research team reports surprising findings that could have significant impact for constructing nano-patterned materials in electronic, magnetic or optical devices.

Ultratech receives multiple system, follow-on order for fan-out wafer-level packaging applications

06/28/2016  Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.

Breakthrough opportunities at SEMICON West for an industry in transition

06/28/2016  With disruptive changes occurring in the electronics supply chain, 26,000 professionals will converge on SEMICON West 2016 (July 12-14) at Moscone Center in San Francisco to hear insider perspectives on what the future holds for the industry.

FormFactor completes acquisition of Cascade Microtech

06/28/2016  FormFactor, Inc. today announced that it has completed the acquisition of Beaverton, Oregon-based Cascade Microtech, Inc.

Digital redefines supply chain: Big change and big opportunity

06/28/2016  With many disruptive changes occurring in the electronics supply chain, the one with the biggest impact may come from smart manufacturing and the emergence of the digital supply chain.

SiC power business is a reality

06/27/2016  Today, SiC benefits are not a secret anymore and progressively lot of industries are considering the development of new products including SiC technologies.

Synopsys and Lattice Semiconductor extend multi-year OEM agreement for FPGA design software

06/27/2016  Synopsys, Inc. today announced a multi-year extension of its OEM agreement with Lattice Semiconductor Corporation for Synopsys' Synplify Pro FPGA synthesis tools.

Building a smart cardiac patch

06/27/2016  'Bionic' cardiac patch could one day monitor and respond to cardiac problems.

Presto Engineering signs agreement with NAGRA for secure product production

06/27/2016  Presto will provide supply chain management and production services for several of NAGRAÂ’s key products in the Pay TV market.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.