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STMicroelectronics and Fidesmo bring secure contactless transactions to wearables in complete payment System-on-Chip

10/19/2018  STMicroelectronics and Fidesmo, the contactless-services developer and Mastercard Approved Global Vendor, have created a turnkey active solution for secure contactless payments on smart watches and other wearable technology.

Samsung debuts semiconductor innovations at Samsung Tech Day

10/19/2018  Technologies introduced at the event include 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM.

ULVAC and the CIA: A sensing story about food and agriculture

10/19/2018  ULVAC TechnologiesÂ’ David Mount is working with The CIA. Is he the Jack Reacher of the MEMS and sensors industry, jetting around the world to secret meetings, you wonder?

GaN semiconductor specialist Exagan forms Taiwan subsidiary

10/18/2018  Exagan, an innovator of gallium nitride (GaN) semiconductor technology enabling smaller and more efficient electrical converters, has established Exagan Taiwan Ltd. with a new sales and applications center in Taiwan.

Micron celebrates 40 years of leadership and innovation

10/18/2018  Micron global sites mark milestone with celebrations around the world.

Samsung Electronics starts production of EUV-based 7nm LPP process

10/18/2018  SamsungÂ’s new 7LPP allows up to 40% increase in area efficiency with 20% higher performance or 50% lower power consumption, resulting in better yields with significantly fewer layers.

Exploring new spintronics device functionalities in graphene heterostructures

10/18/2018  Graphene Flagship researchers have shown in a paper published in Science Advances how heterostructures built from graphene and topological insulators have strong, proximity induced spin-orbit coupling which can form the basis of novel information processing technologies.

IBM, GLOBALFOUNDRIES enhance Si2 Unified Power Model standard

10/17/2018  Silicon Integration Initiative, an integrated circuit research and development joint venture, announced today that IBM and GLOBALFOUNDRIES have contributed patented technology to support the Si2 Unified Power Model standard, the industry's first significant power model enhancement in many years.

Controlling organic semiconductor band gaps by electron-acceptor fluorination

10/17/2018  Researchers from Osaka University develop a fluorinated electron-acceptor unit for high performance organic semiconductors.

Electrical enhancement: Engineers speed up electrons in semiconductors

10/17/2018  Researchers from Graduate School of Bio-Applications and Systems Engineering at Tokyo University of Agriculture and Technology (TUAT) have sped up the movement of electrons in organic semiconductor films by two to three orders of magnitude. The speedier electronics could lead to improved solar power and transistor use across the world, according to the scientists.

Mary Pat McCarthy and Steve Gomo appointed to Micron's Board of Directors

10/17/2018  Micron Technology, Inc. today announced it has appointed two distinguished  finance and technology industry leaders, Mary Pat McCarthy and Steve Gomo, to its board of directors and audit committee.

Communications rise to represent largest portion of foundry sales

10/17/2018  Communications apps expected to account for 3x more than computer in 2018 pure-play foundry sales.

New memristor boosts accuracy and efficiency for neural networks on an atomic scale

10/16/2018  A new parallel processing approach for building resistance-based artificial synapses promises to ramp up efficiency and accuracy by making memristors as thin as a single atom.

New reservoir computer marks first-ever microelectromechanical neural network application

10/16/2018  Researchers used oscillations from a microscopic beam of silicon to enable the nonlinear dynamics that allow neural networks to complete tasks ranging from processing image patterns to recognizing words.

Perovskites: Materials of the future in optical communication

10/16/2018  High performance and stable all? Inorganic metal halide perovskite-based photodetectors for optical communication applications.

SEMI reaffirms support for industry cooperation on RoHS review

10/16/2018  SEMI today confirmed its support for a Joint-Industry Cooperation on an RoHS Review aimed at urging the European Commission to, at a minimum, consider dedicating more resources to a targeted outreach programme with third countries.

Gartner identifies the Top 10 strategic technology trends for 2019

10/15/2018  Analysts explore top industry trends at Gartner Symposium/ITxpo 2018, October 14-18 in Orlando.

MagnaChip introduces high-voltage super junction MOSFET

10/15/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the introduction of a new High-Voltage Super Junction MOSFET with a 900V breakdown voltage and low total gate charge.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.