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Dynamic Fault Detection: Utilizing AI and IoT to revolutionize manufacturing

10/15/2018  A new approach in Fault Detection and Classification (FDC) allows engineers to uncover issues more thoroughly and accurately by taking advantage of full sensor traces.

Hidden gapless states on the path to semiconductor nanocrystals

10/12/2018  When chemists from the Institute of Physical Chemistry of the Polish Academy of Sciences in Warsaw were starting work on yet another material designed for the efficient production of nanocrystalline zinc oxide, they didn't expect any surprises. They were greatly astonished when the electrical properties of the changing material turned out to be extremely exotic.

Researchers quickly harvest 2-D materials, bringing them closer to commercialization

10/12/2018  Efficient method for making single-atom-thick, wafer-scale materials opens up opportunities in flexible electronics.

Global semiconductor sales grow as the industry embraces IoT and blockchain technology

10/12/2018  Many semiconductor companies are beginning to embrace IoT to drive new revenue and growth models.

Seoul Semiconductor wins multiple patent litigations for Acrich MJT and driver technology

10/12/2018  In 2017, Seoul filed the first patent infringement lawsuit against Archipelago for infringement of 12 LED patents covering various aspects of SeoulÂ’s long-established Acrich technology.

GLOBALFOUNDRIES expands RFwave Partner Program to speed time-to-market for wireless connectivity, radar and 5G

10/11/2018  GLOBALFOUNDRIES today announced the addition of nine new partners to its growing RFwave Partner Program.

The global compound semiconductor market grows on increasing demand for optoelectronic devices

10/11/2018  The global compound semiconductor market was valued at USD 66,623 million in 2016 and is expected to reach USD 142,586 million in 2023 while growing at a CAGR of 11.3% from 2017 to 2023.

Toshiba Memory Corporation appoints Stacy J. Smith as Executive Chairman

10/11/2018  Toshiba Memory Corporation (TMC) today announced the appointment of Stacy J. Smith as Executive Chairman, effective on October 1, 2018.

Research on light-matter interaction could improve electronic and optoelectronic devices

10/11/2018  Fundamental research sheds light on new many-particle quantum physics in atomically thin semiconductors.

Micron Foundation announces $1M grant to advance curiosity in artificial intelligence

10/11/2018  The grant was announced at the inaugural Micron Insight 2018 conference where the technology industry's top minds gathered in San Francisco to discuss the future of AI, machine learning and data science, and how memory technology is essential in bringing intelligence to life.

Cadence recognized with four 2018 TSMC Partner of the Year awards

10/10/2018  Cadence Design Systems, Inc. today announced that it has received four TSMC Partner of the Year awards at this yearÂ’s TSMC Open Innovation Platform (OIP) Ecosystem Forum.

GOWIN Semiconductor's GW1NS family of products named Arm TechCon 2018 Innovation Award finalist for design innovation of the year

10/10/2018  GOWIN Semiconductor today announced that its GW1NS product family was named a 2018 Arm TechCon Innovation Award finalist for design innovation of the year.

Study opens route to flexible electronics made from exotic materials

10/10/2018  Cost-effective method produces semiconducting films from materials that outperform silicon.

Presto Engineering upgrades Europe's largest independent semiconductor testing facility to ISO 9001:2015 standard

10/10/2018  Semiconductors play increasingly important control roles in automotive, industrial and safety critical applications. Quality and reliability are therefore of vital importance and so Presto Engineering has completed certification to the ISO 9001:2015 quality standard at its facility in Caen, France, which is EuropeÂ’s largest independent semiconductor test facility.

Mentor releases optimized flow, new fill automation for GLOBALFOUNDRIES' 22FDX IC manufacturing process

10/09/2018  Mentor, a Siemens business, announced it has qualified complete solutions from its Calibre nmPlatform, Analog FastSPICE (AFS) Platform, Eldo Platform and Nitro-SoC place and route system for GLOBALFOUNDRIES' 22FDX Fully-Depleted Silicon-On-Insulator (FD-SOI) integrated circuit (IC) manufacturing processes.

Apple, the best positioned to bring high volume consumer microLEDs to market

10/09/2018  MicroLED displays could potentially match or exceed OLED performance in all critical attributes.

The Gigafab Minute and SEMI Standards: A modern miracle

10/09/2018  Even for someone who has been in this industry since the days of the TI Datamath 4-function calculator and the TMS1100 4-bit microcontroller (yes, thatÂ’s been a LONG time – the movie Grease premiered the same year!), it is sometimes hard to grasp the scope and complexity of what happens in todayÂ’s leading-edge semiconductor gigafabs.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors