10/05/2018 INFICON Inc., a supplier of vacuum instrumentation and process control software to the semiconductor manufacturing industry acquired all assets of Final Phase Systems (FPS) of Austin, Texas, USA.
10/05/2018 Synopsys, Inc. today announced the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) advanced packaging technologies.
10/05/2018 Engineers at The Australian National University (ANU) have invented a semiconductor with organic and inorganic materials that can convert electricity into light very efficiently, and it is thin and flexible enough to help make devices such as mobile phones bendable.
10/04/2018 2017 saw aggregated CIS industry revenue of US$13.9 billion. And 5 years later, the consulting company Yole announces more than US$ 23 billion.
10/04/2018 The American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Analog Photonics (AP) today announced the release of the AP SUNY Process Design Kit v2.5a.
10/04/2018 A team of semiconductor researchers based in France has used a boron nitride separation layer to grow indium gallium nitride (InGaN) solar cells that were then lifted off their original sapphire substrate and placed onto a glass substrate.
10/04/2018 According to data compiled by Inkwood Research, the global semiconductor market is projected to grow at a CAGR of 7.67% during the forecast period from 2017 to 2024.
10/03/2018 ANSYS announced TSMC certified ANSYS solutions for the 7 nanometer FinFET Plus (N7+) process node with extreme ultraviolet lithography (EUV) technology and validated the reference flow for the latest Integrated Fan-Out with Memory on Substrate (InFO_MS) advanced packaging technology.
10/03/2018 Transition metal dichalcogenides (TMDCs) possess optical properties that could be used to make computers run a million times faster and store information a million times more energy-efficiently, according to a study led by Georgia State University.
10/03/2018 SMART Global Holdings, Inc., parent company of SMART Modular Technologies, Inc. announced the appointment of Bryan Ingram, Senior Vice President and General Manager of the Wireless Semiconductor Division of Broadcom Inc., to its board of directors and its Compensation Committee, effective October 2, 2018.
10/02/2018 HEIDENHAIN announces a new series of angle encoders called the ERP 1000 with the design criteria of exceptionally high resolution, high speed, and high contamination resistance.
10/02/2018 Last week, SEMI joined a coalition of business groups in calling for Ambassador Robert Lighthizer, U.S. Trade Representative, to enact an exclusion process for the most recent tranche of tariffs on $200 billion in goods imported from China.
10/01/2018 Visionary keynote speakers and industry luminaries will share insights on Smart technologies that are shaping the future at SEMICON Japan 2018, the largest and most influential exhibition in Japan for electronics manufacturing.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
