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Micron and ATP to collaborate on DDR2 continuity program

10/01/2018  Recognizing the importance of obsolescence mitigation in embedded and industrial systems, two of the biggest names in advanced storage, memory and semiconductor technologies have teamed up to ensure the continuous supply of legacy DDR2 memory modules in the market.

A 'recipe book' that creates color centers in silicon carbide crystals

10/01/2018  Researchers are documenting the different temperature and proton dosages required to make defects that will further allow silicon carbide to be used for quantum technology.

Molex announces agreement to acquire Laird Connected Vehicle Solutions division

09/28/2018  Investment to enhance connected mobility solutions for automotive manufacturers building intelligent next-generation vehicles.

Imagination and GLOBALFOUNDRIES collaborate to deliver ultra-low-power connectivity solutions for IoT applications

09/28/2018  Imagination brings Ensigma Ultra-Low-Power Connectivity IP to GLOBALFOUNDRIES' 22FDX process.

Smart devices could soon tap their owners as a battery source

09/28/2018  The world is edging closer to a reality where smart devices are able to use their owners as an energy resource, say experts from the University of Surrey.

Machine learning helps improving photonic applications

09/28/2018  Nanostructures can increase the sensitivity of optical sensors enormously - provided that the geometry meets certain conditions and matches the wavelength of the incident light. This is because the electromagnetic field of light can be greatly amplified or reduced by the local nanostructure. The HZB Young Investigator Group "Nano-SIPPE" headed by Prof. Christiane Becker is working to develop these kinds of nanostructures.

JCET Group appoints distinguished semiconductor industry executive Dr. Lee Choon Heung as CEO

09/28/2018  Dr. Lee brings to JCET a wealth of expertise and veteran leadership with 20 years of extensive semiconductor packaging and test experience.

Solving the burden of Bourdon tubes

09/27/2018  Mini diaphragm gauges offer a new alternative to Bourdon tubes.

Alpha and Omega Semiconductor announces new TO-leadless packaging technology for high current 400A applications

09/27/2018  Alpha and Omega Semiconductor Limited today introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.

Photonic chips harness sound waves to speed up local networks

09/27/2018  Acoustic noise in chips used to be a nuisance. Now scientists at the University of Sydney Nano Institute have developed a technique to put it to use in receivers of information in fibre-optic networks.

STMicroelectronics unveils highly integrated mobile-security chip

09/27/2018  STMicroelectronics revealed its highly integrated mobile-security solution, the ST54J, a system-on-chip (SoC) containing an NFC (Near-Field Communication) controller, Secure Element, and eSIM.

Canon Marketing Japan announces that it has signed an exclusive distribution agreement with ClassOne Technology Inc.

09/27/2018  Canon Marketing Japan Inc. has signed an exclusive distribution agreement in Japan with ClassOne Technology Inc. and it will start receiving orders for ECD tool Solstice in 2018.

China forecast to account for 90% of pure-play foundry market growth in 2018

09/26/2018  Driven by cryptocurrency device demand, TSMC's China sales are expected to surge by 79% this year.

Picosun-SINANO collaboration yields excellent TiN process

09/26/2018  Picosun Group and Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO) report excellent quality titanium nitride (TiN) deposited with PicosunÂ’s plasma-ALD technology.

Study demonstrates new mechanism for developing electronic devices

09/26/2018  OIST scientists have demonstrated a new mechanism that may help develop electronic devices differently.

WIN Semiconductors Corp integrated GaAs technologies support 5G user equipment and network infrastructure

09/26/2018  WIN Semiconductors Corp., the world?'s largest pure-play compound semiconductor foundry, is driving the development and deployment of 5G user equipment and network infrastructure in the sub-6GHz and mmWave frequency bands.

China trade brings semiconductor executives to DC for the Fall Washington Forum

09/26/2018  Last week, more than a dozen senior semiconductor executives traveled to Washington, DC for the first-ever Fall Washington Forum.

GLOBALFOUNDRIES delivering 8SW RF SOI client chips on 300mm platform for next-generation mobile applications

09/26/2018  RF SOI technology builds on manufacturing legacy that reaches new milestone with more than 40 billion chips shipped.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.