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UIC chemical engineers first to functionalize boron nitride with other nanosystems

09/25/2018  Researchers unlock potential for improving composite material.

GLOBALFOUNDRIES extends FinFET offering with new features to enable tomorrow's intelligent systems

09/25/2018  Feature-rich semiconductor platform delivers competitive performance and scalability for next-generation compute applications.

Semiconductor analyst Mark Lipacis to present featured keynote at GSA Silicon Summit

09/25/2018  Managing Director of Jefferies Group LLC to discuss next semiconductor growth opportunity at October 9 conference, which is designed to advance technology, business and collaboration.

Oxygen vs. nanochip

09/25/2018  Scientists show the vulnerability of a promising two-dimensional semiconductor to air, and discover new catalyst.

IBM Research - Almaden vice president to keynote at The ConFab 2019

09/25/2018  The ConFab, preeminent semiconductor manufacturing and design conference slated for May 14-17, announces IBM VP and lab director will deliver address on advanced computing technologies for AI.

Professors from MIT, University of Illinois at Urbana-Champaign to be honored for excellence in semiconductor research

09/24/2018  Professors Hoyt and Shanbhag will receive the awards in conjunction with the SIA Annual Award Dinner on Nov. 29, 2018 in San Jose, Calif.

Rice U. study sheds light on -- and through -- 2D materials

09/24/2018  High-performance computing helps to survey optical qualities of atom-thick materials for optoelectronics.

Smaller, faster and more efficient modulator sets to revolutionize optoelectronic industry

09/24/2018  A research team comprising members from City University of Hong Kong (CityU), Harvard University and renowned information technologies laboratory has successfully fabricated a tiny on-chip lithium niobate modulator, an essential component for the optoelectronic industry.

MagnaChip to host Foundry Technology Symposium in Shenzhen, China in November 2018

09/24/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it will hold a Foundry Technology Symposium at the Shangri-La in Shenzhen, China, on November 27, 2018.

STMicroelectronics and Leti develop GaN-on-silicon technology for power conversion applications

09/24/2018  STMicroelectronics and Leti, a research institute of CEA Tech, today announced their cooperation to industrialize GaN (Gallium Nitride)-on-Silicon technologies for power switching devices.

North American semiconductor equipment industry posts August 2018 billings

09/21/2018  Global billings of North American equipment suppliers declined in August when compared to July, although they remain above August 2017 billings.

Lam Research names 2018 Supplier Excellence Award recipients

09/21/2018  Six companies awarded for overall supplier excellence.

RISC-V Foundation announces initial keynote speakers for inaugural RISC-V Summit

09/21/2018  First RISC-V Summit features keynotes from Antmicro, Facebook, Microchip Technology, NXP, SiFive and Western Digital.

Micron appoints Mike Bokan as Senior VP, Worldwide Sales

09/21/2018  Micron Technology, Inc. announced today that the company has appointed Mike Bokan as senior vice president of Worldwide Sales, effective Oct. 1, 2018.

Plessey chooses AIX G5+ C MOCVD tool for GaN-on-Silicon monolithic microLEDs display innovation

09/20/2018  Plessey, a developer of award-winning optoelectronic technology solutions, announces it has placed an order for its next reactor from AIXTRON SE.

Toshiba Memory and Western Digital celebrate the opening of Fab 6 and Memory R&D Center at Yokkaichi, Japan

09/20/2018  Toshiba Memory Corporation and Western Digital Corporation yesterday celebrated the opening of a new semiconductor fabrication facility, Fab 6, and the Memory R&D Center, at Yokkaichi operations in Mie Prefecture, Japan.

Graphene bilayer provides efficient transport and control of spins

09/20/2018  University of Groningen physicists in collaboration with a theoretical physics group from Universität Regensburg have built an optimized bilayer graphene device which displays both long spin lifetimes and electrically controllable spin-lifetime anisotropy.

NXP Semiconductors announces $1B bridge financing

09/20/2018  NXP announced a US$1,000,000,000 senior unsecured bridge term credit facility agreement.

Commercially relevant bismuth-based thin film processing

09/19/2018  Researchers from Osaka University demonstrate a photoresponsive film processing technique that balances morphological properties with electronic performance.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.