09/13/2018 Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.
09/13/2018 MEMS & Sensors Executive Congress speakers to provide insights into enabling connected devices for wearables, robotics, cars, and autonomous applications October 29-30 in Napa Valley, Calif.
09/13/2018 MCU sales and units shipments driven by the spread of embedded control in systems, more sensors, and the rush to connect end-use applications to the Internet of Things (IoT).
09/13/2018 SEMI's Serena Brischetto caught up with Zimmer and Peacock Director Martin Peacock to discuss sensor opportunities and challenges ahead of the European MEMS & Sensors and Imaging & Sensors Summits.
09/12/2018 A study by the University of Basel presents a new technique to obtain an individual fingerprint of the current-carrying edge states occurring in novel materials.
09/12/2018 A new wearable ultrasound patch that non-invasively monitors blood pressure in arteries deep beneath the skin could help people detect cardiovascular problems earlier on and with greater precision.
09/12/2018 Sandwiching two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases and an ultrathin layer of aluminum oxide can significantly reduce the risk of component failure due to overheating, according to a new study led by researchers at the University of Illinois at Chicago College of Engineering.
09/11/2018 Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in Japan's industry-leading event.
09/11/2018 Scientists have developed a photoelectrode that can harvest 85 percent of visible light in a 30 nanometers-thin semiconductor layer between gold layers, converting light energy 11 times more efficiently than previous methods.
09/11/2018 This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.
09/10/2018 Tight supplies of display panel materials and components, such as driver integrated circuit (IC), glass substrate and polarizer, are expected to slow the decline rate of liquid crystal display panel costs.
09/10/2018 Air Products today announced it has been awarded by Samsung Electronics additional gaseous nitrogen and hydrogen supply to its semiconductor fab in Giheung, South Korea.
09/10/2018 Researchers from the Singapore University of Technology and Design (SUTD) have made a major step forward in resolving the mysteries surrounding 2D material Schottky diode.
09/10/2018 Worldwide semiconductor manufacturing equipment billings reached US$16.7 billion in the second quarter of 2018, 1 percent lower than the previous record quarter and 19 percent higher than the same quarter a year ago.
09/10/2018 Are you ready for a shared economy where your transportation needs are no longer met by an automaker, but rather a "mobility service provider"?
09/07/2018 Nova announced today that a major foundry recently placed an order for its VeraFlex advanced X-Ray metrology solution for 5nm technology node.
09/07/2018 SEMI spoke with Christian Mandl, Senior Director for Human Machine Interface (HMI), Infineon Technologies AG, ahead of the European MEMS & Sensors Summit.
