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Global semiconductor sales increase 17.4% year-to-year in July

09/06/2018  Global industry posts highest-ever monthly sales; year-to-year growth seen across all major semiconductor product categories and regional markets.

Industry's only worldwide OSAT manufacturing sites database now tracks 320 facilities

09/06/2018  SEMI and TechSearch International database also revises facility technology capabilities and offerings.

GLOBALFOUNDRIES CTO Gary Patton to deliver opening keynote at GSA Silicon Summit

09/06/2018   Dr. Gary Patton, Chief Technology Officer and Senior Vice President of Worldwide Research and Development at GLOBALFOUNDRIES, will deliver the opening keynote address at the inaugural GSA Silicon Summit – East, being held Tuesday, October 9 in Saratoga Springs, NY. 

Researchers use silicon nanoparticles for enhancing solar cells efficiency

09/06/2018  An international research group improved perovskite solar cells efficiency by using materials with better light absorption properties.

The future of MEMS and sensors: Beyond human senses

09/06/2018  2017 was a good year for the MEMS and sensors business, and that upward trend should continue.

OEM Group introduces next-generation Spin Rinse Dryer (SRD)

09/05/2018  OEM Group announced a major engineering design upgrade of its Semitool Spin Rinse Dryer, a platform for removing residual chemicals from semiconductor substrates and other materials such as optical lenses.

Lattice Semiconductor appoints Steve Douglass as Corporate VP, R&D

09/05/2018  Lattice Semiconductor Corporation, a provider of customizable smart connectivity solutions, announced the appointment of Steve Douglass as the Company's Corporate Vice President, R&D, effective immediately.

Veeco announces changes to executive leadership team

09/05/2018  John Peeler to remain as Executive Chairman as Bill Miller becomes CEO on October 1, 2018.

SEMI Europe and AENEAS collaborate to support European electronics industry growth

09/05/2018  SEMI Europe and AENEAS today announced that they have signed a Memorandum of Understanding (MOU) to form a strategic partnership to support the European electronics industry's growth.

Leti and Vsora demonstrate 3GPP new radio on multi-core digital signal processor

09/04/2018  Leti, a research institute of CEA Tech, and VSORA, which specializes in multi-core digital signal processor (DSP) design, today announced they have demonstrated the implementation of 5G New Radio (5G NR) Release 15 on a new DSP architecture that can dramatically reduce time to market of digital modems.

SEMICON Taiwan opens with AI, IoT, automotive in the spotlight

09/04/2018  Semiconductor industry growth drivers artificial intelligence (AI), Internet of Things (IoT) and automotive take center stage as more than 45,000 visitors gather at SEMICON Taiwan starting today.

NXP acquires OmniPHY

09/04/2018  NXP Semiconductors N.V., the world's largest supplier of automotive semiconductors, has acquired OmniPHY, a provider of automotive Ethernet subsystem technology.

Brewer Science announces RDL-first fan-out packaging material

09/04/2018  Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials.

KLA-Tencor expands IC packaging portfolio

08/31/2018  KLA-Tencor Corporation announced two new defect inspection products designed to address a wide variety of integrated circuit (IC) packaging challenges.

Large TFT LCD shipments hit record monthly high in July 2018

08/31/2018  Expanded production capacity, historical-low LCD TV panel prices and panel makersÂ’ efforts to clear up inventories help.

Universal Display Corporation announces recipients of the 2018 UDC Innovative Research and Pioneering Technology Awards at IMID Korea

08/31/2018  These awards were presented at the 18th International Meeting of Information Display (IMID) conference on August 30, 2018 in Busan, Korea by Dr. Julie Brown, Senior Vice President and Chief Technology Officer of Universal Display.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.