Featured Content




Nano-imaging of intersubband transitions in few-layer 2-D materials

08/27/2018  A study in Nature Nanotechnology reports on the first observation of intersubband transitions in 2-D materials via scattering scanning near-field optical microscopy.

A human enzyme can biodegrade graphene

08/24/2018  Graphene Flagship partners discovered that a natural human enzyme can biodegrade graphene. These findings could have great implications in the development of graphene-based biomedical devices.

Watlow acquires Yarbrough Solutions Worldwide

08/24/2018  Watlow, a designer and manufacturer of complete thermal systems, announced that it has acquired Yarbrough Solutions Worldwide of Austin, Texas.

North American semiconductor equipment industry posts July 2018 billings

08/24/2018  Global billings declined for the second month in a row, indicative of customer push-outs.

Gartner identifies five emerging technology trends that will blur the lines between human and machine

08/23/2018  The 35 must-watch technologies represented on the Gartner Inc. Hype Cycle for Emerging Technologies, 2018 revealed five distinct emerging technology trends that will blur the lines between humans and machines.

Samsung's Exynos i S111 delivers efficiency and reliability for NB-IoT devices

08/23/2018  New IoT solution includes modem, processor, memory and GNSS functions in one chip.

Immersion announces appointment of Tom Lacey as interim CEO and board member

08/23/2018  Lacey succeeds Carl Schlachte, the companyÂ’s prior Interim CEO, who is resigning as a director of Immersion.

Helping the microchip industry go (very low) with the flow

08/23/2018  A new NIST analysis reveals a heated source of potentially expensive errors.

The largest compound semiconductor device maker in China selects ClassOne Solstice CopperMax electroplating system

08/23/2018  ClassOne Technology today announced a multi-tool sale of its flagship Solstice CopperMax electroplating system to ChinaÂ’s premier compound semiconductor manufacturer.

IDT and Steradian Semiconductors announce strategic partnership

08/22/2018  Integrated Device Technology, Inc. announced today a strategic partnership with Steradian Semiconductor Pvt. Ltd. to deliver ultra-high resolution 4D mmWave imaging RADAR for emerging industrial, security, medical, and autonomous vehicle markets.

SemtechÂ’s LoRa technology creates IoT metering solutions to improve facility management in China

08/22/2018  EasyLinkinÂ’s LoRa-based IoT solutions gather data and analytics on utility usage.

Sanan IC goes global, emerges as a world-class III-V technology platform company

08/22/2018  Sanan Integrated Circuit Co., a pure-play compound semiconductor foundry, today announces its entry into the North American, European, and Asia Pacific (APAC) markets with their advanced III-V technology platform.

ASIC Design Services adds Core Deep Learning IP to SiFive DesignShare program

08/21/2018  SiFive, a provider of commercial RISC-V processor IP, today announced that ASIC Design Services, a design house, IP provider, and a distributor for FPGA and EDA software, has joined the DesignShare ecosystem.

MRSI Systems launches MRSI-HVM3P for new applications extending the MRSI-HVM3 die bonder family

08/21/2018  MRSI Systems (Mycronic Group), is expanding its high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC).

Murata invests in MEMS sensor manufacturing in Finland

08/21/2018  Murata Manufacturing Co., Ltd. expands its MEMS sensor manufacturing by building a new factory in Vantaa, Finland to increase the sensor production capacity.

TowerJazz to showcase SiGe and silicon photonic process solutions for 100 to 400Gb/s optical data links at ECOC

08/21/2018  The Company will showcase its advanced SiGe (Silicon Germanium) process, with speeds in excess of 300GHz, and its newest production SiPho (Silicon Photonics) process built into data center high-speed optical data links.

Soitec and MBDA to acquire Dolphin Integration Assets

08/21/2018  Soitec (Euronext Paris), a designer and manufacturer of semiconductor materials, and MBDA, announce the joint acquisition of Dolphin Integration.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors