04/03/2014 This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.
04/03/2014 Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries.
04/03/2014 Park Systems this week introduced the Automatic Defect Review (ADR)AFM for 300mm bare wafers, a fully automated AFM solution that improves throughput of AFM defect review by up to 1,000 percent.
04/03/2014 ON Semiconductor today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.
04/02/2014 MEMS microphone market has been growing since its first appearance in 2003. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market.
04/01/2014 These products work well for applications requiring a balance of chemical resistance and mechanical strength in high temperature environments like those frequently found in the oil and gas, chemical processing, and semiconductor industries.
04/01/2014 SureCore Ltd has today announced that early testing of its innovative low power SRAM design confirms its simulations that deliver in excess of 50 percent power savings over other SRAM technologies.
04/01/2014 Tufts University engineers have demonstrated that it is possible to generate nanostructures from silk in an environmentally friendly process that uses water as a developing agent and standard fabrication techniques.
04/01/2014 Researchers at the University of Illinois at Urbana-Champaign have achieved new levels of performance for seed-free and substrate-free arrays of nanowires from class of materials called III-V (three-five) directly on graphene
03/31/2014 Altatech, a subsidiary of Soitec, has received an order from the University of Washington in Seattle for an AltaCVD chemical vapor deposition (CVD) system whose unique combination of capabilities allows users to develop new process materials with high added value.
03/31/2014 SEMATECH, the global consortium of semiconductor manufacturers, announced today that Ronald Goldblatt, vice president of Technical Strategy and Operations, has been appointed by the board of directors as acting president and chief executive officer, effective immediately.
03/28/2014 InvenSense, Inc. and Sonion today announced a strategic alliance in which the two parties will cooperate in the development of MEMS microphones and related technologies for use in a broad range of hearing applications.
03/27/2014 CEA-Leti will demonstrate its new prototype for wireless high data rate Li-Fi (light fidelity) transmission at Light + Building 2014 in Frankfurt, Germany, March 30-April 4. The technology employs the high-frequency modulation capabilities of light-emitting diode (LED) engines used in commercial lighting.
03/27/2014 Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, has added semiconductor industry veteran Joe Medeiros to its growing management staff.
03/27/2014 Samsung today introduced a new lineup of flip chip LED packages and modules offering enhanced design flexibility and a high degree of reliability.
03/26/2014 Nanolab Technologies, a Silicon Valley-based analytical services lab, has purchased and installed new tools and moved to a seven-day workweek.
03/26/2014 This collaboration will address many of the profound changes taking place in the semiconductor industry that are impacting fundamental aspects of process and equipment design, including integration of new materials and process technology for sub-20nm node manufacturing, next-generation lithography requirements.
