03/26/2014 Collaboration will optimize integration of 14nm Tri-Gate Stratix 10 FPGAs with heterogeneous technologies into a single system-in-a-package.
03/25/2014 Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes?
03/21/2014 Researchers from North Carolina State University have developed a new processing technique that makes light emitting diodes (LEDs) brighter and more resilient by coating the semiconductor material gallium nitride (GaN) with a layer of phosphorus-derived acid.
03/21/2014 From super-lubricants, to solar cells, to the fledgling technology of valleytronics, there is much to be excited about with the discovery of a unique new two-dimensional semiconductor, rhenium disulfide, by researchers at Berkeley LabÂ’s Molecular Foundry.
03/21/2014 Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.
03/20/2014 ChaoLogix, Inc., a semiconductor technology provider focused on developing embedded security and low-power design intellectual property, today introduced ChaoSecure technology that deters side channel attacks on semiconductor chips and contributes a superior layer of security compared to existing solutions.
03/20/2014 North America-based manufacturers of semiconductor equipment posted $1.29 billion in orders worldwide in February 2014 (three-month average basis) and a book-to-bill ratio of 1.00.
03/20/2014 Applied Materials, Inc. today announced that it was named a 2014 World's Most Ethical Company by the Ethisphere Institute, an independent center of research promoting best practices in corporate ethics and governance.
2.5/3D integration and advanced packaging enable better chip performance in a smaller form factor, meeting the needs of smartphones, tablets, and other advanced devices. However, 2.5/3D packaging creates a new set of manufacturing challenges, such as the need to fabricate copper pillars, TSVs, wafer bumping and redistribution layers – which may involve thicker photoresists, spin-on dielectrics and BCB coatings -- and processing may be done on panels instead of round wafers. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.
03/19/2014 Synopsys, Inc. today announced that MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions, has initiated deployment of Synopsys' IC Compiler place and route solution for hierarchical design implementation.
03/19/2014 Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC presented the SEMICON China 2014 opening keynote yesterday and was given a SEMI Outstanding EHS Achievement Award.
03/19/2014 Siemens Industry Automation Division and M+W Group have joined forces with the aim to advance the development of production technology for battery manufacturing and develop a complete control technology solution for the mass production of large-size batteries.
03/19/2014 Research from University of California, Berkeley scientists sponsored by Semiconductor Research Corporation (SRC) promises to revolutionize portable radio frequency (RF) electronics and communication systems via advancements in on-chip inductors by leveraging embedded nanomagnets.
03/18/2014 To meet the increasing demand for smaller, faster, and more powerful devices, a continued decrease in the dimensions of active parts of devices is required. The new methodology is a unique tool developed to address the gap existent in the metrology of sub-10nm line patterns.
03/18/2014 MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, today announced it has agreed to purchase the assets of Granville-Phillips, a division of Brooks Automation, Inc., for $87 million in cash.
03/18/2014 Over the last years, inertial MEMS have been subject to dramatic market & technological evolution. This has been driven by a large increase of the consumer market.
