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Leti demonstrates ultra-scaled self-aligned split-gate memory cell with 16nm gate length

03/11/2014  CEA-Leti announced today it has fabricated ultra-scaled split-gate memories with gate length of 16nm, and demonstrated their functionality, showing good writing and erasing performances with memory windows over 6V.

Cadence PVS certified for GlobalFoundries' 65nm to 14nm processes

03/11/2014  Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES certified the Cadence Physical Verification System (PVS) for custom/analog, digital and mixed-signal design physical signoff for 65nm to 14nm FinFET process technologies.

Touch International unveils new highly advanced projected capacitive touch technology

03/11/2014  Specialty touch screen and display enhancement manufacturer, Touch International confirmed today the release of a new touch sensing technology that overcomes the limitations of current projected capacitive (p-cap) offerings.

Plug-and-play test strategy for 3D ICs

03/11/2014  Three-dimensional (3D) ICs, chips assembled from multiple vertically stacked die, are coming. They offer better performance, reduced power, and improved yield.

Akustica's newest MEMS microphone targets smartphones and wearables

03/11/2014  Akustica, Inc., a Bosch Group company and provider of MEMS microphones, has added four new high-performance analog microphones to its high definition (HD) voice product line, including the AKU346, the industry?'s smallest MEMS microphone to achieve 64dB SNR.

DSA, EUV, nanopatterning are top themes at SPIE Advanced Lithography

03/10/2014  Progress through collaborative efforts in directed self-assembly (DSA), the state of the art in nanoimprint technology, 3D approaches to scaling, and the latest on extreme ultraviolet (EUV) lithography research were hot topics at the recent SPIE Advanced Lithography symposium in San Jose.

SiC power device advantages enhance power conversion systems

03/10/2014  Compared to silicon, SiC has ten times the dielectric breakdown field strength, three times the bandgap and three times the thermal conductivity.

Electrolube launches versatile new silver conductive adhesive for display applications

03/10/2014  Electrolube, the leading supplier of formulated chemical products to the global electronic, industrial and domestic devices manufacturing sectors, will be launching a versatile new silver conductive adhesive at APEX Expo 2014 in Las Vegas (March 25-27).

Double digit growth for China LED production in 2014

03/10/2014  Following the boom in expansion of the Chinese LED market in 2011, many industry insiders and analysts speculated on whether the Chinese would be able to sustain the growth, or if many companies simply ordered an excessive amount of MOCVD reactors just to benefit from government subsidies.

Promising news for solar fuels from Berkeley Lab researchers at JCAP

03/07/2014  A JCAP study shows that nearly 90-percent of the electrons generated by a semiconductor/cobaloxime hybrid catalyst designed to store solar energy in hydrogen are being stored in their intended target molecules.

New innovation could mean eye injections are a thing of the past

03/07/2014  Drugs used to treat blindness-causing disorders could be successfully administered by eye drops rather than unpleasant and expensive eye injections, according to new research led by UCL scientists that could be a breakthrough for the millions worldwide suffering from age-related macular degeneration (AMD) and other eye disorders.

Squeezing light into metals

03/07/2014  Using an inexpensive inkjet printer, University of Utah electrical engineers produced microscopic structures that use light in metals to carry information.

MACOM introduces new addition to GaN in Plastic series

03/07/2014  M/A-COM Technology Solutions Inc. (MACOM), a supplier of high performance RF, microwave, and millimeter wave products, introduced today its newest addition to the GaN in Plastic series.

Semtech Corporation announces the appointment of new Executive VP

03/07/2014  Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced the appointment of Charles B. Ammann as Executive Vice President, General Counsel and Corporate Secretary.

Weaker yen impact on the 2013 material and equipment market size

03/06/2014  Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.

Micron appoints Darren Thomas as VP of Storage Business Unit

03/06/2014  Micron Technology, Inc. this week announced that Darren Thomas has been named as vice president of Micron's Storage business unit.

New research could help make "roll-up" digital screens a reality for all

03/06/2014  Researchers from the University of Surrey worked together with scientists from Philips to further develop the 'Source-Gated-Transistor' (SGT) - a simple circuit component invented jointly by the teams.

Samsung expands its 28nm technology offerings

03/06/2014  Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities.