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Dow Corning releases new terminal sealant for manufacturing TFT LCD displays

02/25/2014  Dow Corning today introduced new Dow Corning EA-2000 Silicone Adhesive, a high-performance terminal sealant for faster, more cost-effective manufacturing of thin-film transistor (TFT) LCD displays.

EVG and Brisbane Materials introduce novel anti-reflective coating solution for LED lighting applications

02/25/2014  The jointly developed manufacturing solution enables lumen output increases of up to eight percent.

Movidius joins the Global Semiconductor Alliance

02/24/2014  Movidius today announced that it has joined the Global Semiconductor Alliance (GSA).

Call for Papers open for SEMICON Europa 2014, Plastics Electronics Conference

02/24/2014  SEMI announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014 which takes place October 7-9 in Grenoble, France.

Soraa develops the world's most efficient LEDs

02/24/2014  Soraa announced today the worldÂ’s most efficient LED, which it will integrate into the marketÂ’s first full-visible-spectrum, large form factor lamps.

The need for high sigma yield

02/24/2014  Dr. Bruce McGaughy, Chief Technology Officer and Senior Vice President of Engineering, ProPlus Design Solutions, Inc., says the move to state-of-the-art 28nm/20nm planar CMOS and 16nm FinFET technologies present greater challenges to yield than any previous generation.

International Rectifier opens ultra-thin wafer processing facility in Singapore

02/24/2014  International Rectifier, IR, today announced that the company has commenced initial production at its new ultra-thin wafer processing facility in Singapore (IRSG).

Europe launches PLACYD, a large consortium to address DSA lithography

02/24/2014  PLACYD, an EU funded consortium of industrial and academic collaborators and led by Arkema will establish a dedicated material manufacturing facility that allows the production of block copolymers meeting the rigorous standards required for their use in industry as nanolithographic templates.

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04

02/21/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

SMIC and JCET establish joint venture for 12 inch bumping and testing

02/21/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, and Jiangsu Changjiang Electronics Technology Co., Ltd., the largest packaging service provider in China, jointly announced today a joint venture for 12" bumping and related testing.

Frost & Sullivan recognize RFaxis with Award for Technology Innovation Leadership

02/21/2014  Based on its recent analysis of the market for radio frequency front-end module (RF FEM) solution for wireless communication, Frost & Sullivan recognizes RFaxis, Inc. with the 2014 North American Frost & Sullivan Award for Technology Innovation Leadership.

Samsung and UCSF partner to accelerate new innovations in preventive health technology

02/21/2014  Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.

Single chip device to provide real-time 3-D images from inside the heart and blood vessels

02/20/2014  Researchers have developed the technology for a catheter-based device that would provide forward-looking, real-time, three-dimensional imaging from inside the heart, coronary arteries and peripheral blood vessels.

Epoxy Technology and John P. Kummer Group announce a new specialty adhesive packaging company

02/20/2014  Epoxy Technology, Inc. and John P. Kummer Group announce the formation of a new specialty adhesive packaging company, Epoxy Technology Europe Ltd (ETEL).

Semiconductor industry posts record sales in 2013

02/20/2014  The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industryÂ’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

Solid doping for bulk finFETs

02/20/2014  In another example of the old one-liner that “all that is old is new again,” the old technique of solid-source doping is being used by Intel for a critical process step in so-called “14nm node” finFET manufacturing.

Reframing the Roadmap: ITRS 2.0

02/20/2014  The International Technology Roadmap for Semiconductor (ITRS) is being reframed to focus more on end applications, such as smartphones and micro-servers.

Using holograms to improve electronic devices

02/20/2014  A team of researchers from the University of California, Riverside Bourns College of Engineering and Russian Academy of Science have demonstrated a new type of holographic memory device that could provide unprecedented data storage capacity and data processing capabilities in electronic devices.