02/20/2014 Plasma-Therm announced today that it has entered into a new cross licensing agreement with ON Semiconductor to enable wafer singulation processes.
02/20/2014 Inpria Corporation announced today that it has received $4.7M of a committed $7.3M financing. The round was led by Samsung Venture Investment Corporation, the global investment arm of the Samsung Group, along with significant participation from Intel Capital, IntelÂ’s global investment and M&A organization.
02/19/2014 MCA Public Relations announced it has launched a new solid-state lighting (SSL) practice specifically designed to target companies from the multiple segments of the SSL ecosystem to create unique branding and communications campaigns for each.
02/19/2014 Avantor Performance Materials, a global manufacturer and supplier of high-performance chemistries, announces the appointment of Jean-Paul Mangeolle to its Board of Directors.
02/19/2014 Plansee develops improved replacement parts from refractory metals, graphite, and ceramic for ion implanters from all major manufacturers. The latest development is a high performance extraction assembly for VIISta HCP, HCS, Trident, and NexGen configured systems.
02/18/2014 Imec, in collaboration with Vrije Universiteit Brussel, Brussels, Belgium, presents the worldÂ’s first 79 GHz radar transmitter implemented in plain digital 28nm CMOS.
02/18/2014 Dr. Tae-Wook Kim at KIST announced their successful development of a 64-bit memory array using flexible and twistable carbon nano material and organo-polymer compound, which can accurately store and delete data.
02/18/2014 GaN Systems Inc, a developer of gallium nitride power switching semiconductors, has announced the appointment of Tony Astley as Director of European Operations.
02/18/2014 M/A-COM Technology Solutions Inc., a supplier of high performance analog, RF, microwave and millimeter wave products, last week announced that it has acquired Nitronex, LLC.
02/18/2014 Renesas Electronics Corporation today announced that it has developed the industry's first 28nm flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.
02/14/2014 Dow Electronic Materials, a business unit of The Dow Chemical Company, today introduced the IKONIC 4000 series of chemical mechanical planarization (CMP) polishing pads.
02/14/2014 Honeywell announced today that it has introduced new RadLo low alpha plating anodes based on proprietary technology to help reduce alpha particle radiation that can lead to data errors in semiconductors.
02/14/2014 Honeywell announced today that it has introduced new copper manganese (CuMn) sputtering targets for semiconductor manufacturing based on patented technology offering customers higher strength, longer life, and better performance.
02/13/2014 Whenever a new material is discovered, scientists are eager to find out whether or not it can be superconducting. This applies particularly to the wonder material graphene.
02/13/2014 SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.
02/13/2014 ROHM Semiconductor today introduced the development of the BD5291G and the BD5291FVE low voltage, low offset operational amplifiers (opamp) designed to amplify signals from motion sensors such as accelerometers and gyroscopes.
