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Shipments of flexible AMOLED panels expected to exceed rigid panels by 2020

08/13/2018  Amid growing demand for active matrix organic light-emitting diode (AMOLED) panels for smartphones, shipments of flexible AMOLED panels are expected to account for more than 50 percent of total AMOLED panel shipments by 2020.

Keysight Technologies acquires Thales Calibration Services

08/13/2018  This acquisition establishes Keysight as the largest calibration and support services organization in Australia.

'Building up' stretchable electronics to be as multipurpose as your smartphone

08/13/2018  By stacking and connecting layers of stretchable circuits on top of one another, engineers have developed an approach to build soft, pliable "3D stretchable electronics" that can pack a lot of functions while staying thin and small in size.

Terahertz technology creates new insight into how semiconductor lasers work

08/13/2018  Pioneering engineers working with terahertz frequency technology have been researching how individual frequencies are selected when a laser is turned on, and how quickly the selection is made.

Optoelectronics market worth $9.80B by 2025

08/10/2018  The market is estimated to be USD 3.88 billion in 2018 and is projected to reach a market size of USD 9.80 billion by 2025, growing at a CAGR of 14.13% during the forecast period.

Seoul Viosys introduces new 'UV WICOP' in the UV LED market

08/10/2018  Seoul Viosys announced that its product named UV WICOP which combines Seoul SemiconductorÂ’s WICOP LEDs with compact and high efficiency technology have been launched.

For UW physicists, the 2-D form of tungsten ditelluride is full of surprises

08/10/2018  The general public might think of the 21st century as an era of revolutionary technological platforms, such as smartphones or social media. But for many scientists, this century is the era of another type of platform: two-dimensional materials, and their unexpected secrets.

Yale-NUS scientist and collaborators solve open theoretical problem on electron interactions

08/10/2018  The discovery will help scientists better understand electron interaction in new materials, paving the way for developing advanced electronics such as faster processors.

CyberOptics demonstrates Airborne Particle and Ultra High-Resolution MRS sensors at SEMICON Taiwan

08/09/2018  Significantly improving yields and tool uptime in semiconductor fabs worldwide.

Rudolph Technologies appoints David B. Miller as Chairman of the Board

08/09/2018  Mr. MillerÂ’s appointment is subsequent to the CompanyÂ’s receipt of Thomas G. GreigÂ’s resignation from the position.

ClassOne places Solstice CopperMax electroplating tool with defense industry supplier i3 Microsystems

08/09/2018  ClassOne, a supplier of new electroplating and wet process tools to the 200mm and smaller semiconductor manufacturing industry, today announced the sale its flagship Solstice S8 CopperMax electroplating tool to i3 of Binghamton, NY.

Multilayer chip beads with high rated currents

08/08/2018  TDK Corporation has developed the new MPZ0603-H series of multilayer chip beads for power lines in an IEC 0603 package that feature twice the rated current and about half the DC resistance of the existing MPZ0603-C series.

European electronics industry CEOs call on European Commission to bolster sector's competitiveness

08/08/2018  In a bid to reinvigorate EuropeÂ’s electronics strategy and strengthen the regionÂ’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

Tying down electrons with nanoribbons

08/08/2018  'Topological' graphene nanoribbons trap electrons for new quantum materials

Average design cost for basic SoCs across all geometries was $1.7M in 2017, says Semico Research

08/07/2018  The semiconductor industry today is faced with several substantial issues-not the least of which are the continuing rise in design costs for complex SoCs, the decrease in the incidence of first-time-right designs and the increase in the design cycle time against shrinking market windows and decreasing product life cycles.

Integrated sensor could monitor brain aneurysm treatment

08/07/2018  A multi-university research team has demonstrated proof-of-concept for a highly flexible and stretchable sensor that could be integrated with the flow diverter to monitor hemodynamics in a blood vessel without costly diagnostic procedures.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.