12/23/2013 A team of material scientists, chemical engineers and physicists from the University of Pennsylvania has made another advance in their effort to use liquid crystals as a medium for assembling structures.
12/20/2013 TowerJazz, a global specialty foundry, and Panasonic Corporation today announced the signing of a definitive agreement to create a joint venture (JV) to manufacture PanasonicÂ’s products, using Panasonic's three semiconductor manufacturing facilities in Japan
12/20/2013 North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11.
12/18/2013 The RIE-800iPBC is the latest in SAMCO's etching system lineup, and was officially introduced by SAMCO at SEMICON Japan 2013 (the world's largest exhibition for semiconductor equipment and materials), held in Tokyo from December 4-6, 2013.
12/18/2013 M/A-COM Technology Solutions Holdings, Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced that it has successfully completed its previously announced tender offer to purchase all outstanding shares of common stock of Mindspeed Technologies, Inc. for $5.05 per share in cash.
12/17/2013 Integrated Device Technology, Inc. today announced the appointment of Greg Waters, 53, as President, Chief Executive Officer and board member, effective January 6, 2014. Jeff McCreary, who served as interim CEO since August 2013, will remain a member of the IDT board of directors.
12/17/2013 Micron Technology, Inc., a providers of advanced semiconductor solutions, today announced its collaboration with Broadcom Corporation to develop the industry's first solution designed for customers challenged by an intrinsic DDR3 timing parameter called tFAW, or four activate window.
12/17/2013 Molecularly thin two-dimensional crystals can alleviate the lattice matching restrictions of epitaxial crystalline thin film growth, as reported by researchers in Japan.
12/16/2013 Mindspeed Technologies, Inc., a supplier of semiconductor solutions for network infrastructure, today announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corporation.
12/16/2013 Avago Technologies Limited and LSI Corporation today announced that they have entered into a definitive agreement under which Avago will acquire LSI for $11.15 per share in an all-cash transaction valued at $6.6 billion.
12/16/2013 Samsung Electronics Co., Ltd. announced the appointment of Gregory Lee as President of the North America Headquarters in addition to his role as President of Samsung Telecommunications America (STA) effective immediately.
12/16/2013 3DIC memory, and therefore all of 2.5/3D technology, took one step closer to full commercialization last week with the HBM joint development announcement from AMD and Hynix at the RTI 3D ASIP meeting in Burlingame CA.
12/16/2013 Today at the 2013 American Society for Cell Biology Annual Meeting, Bruker introduced the Opterra Multipoint Scanning Confocal Microscope, which sets a new standard for integration of confocal imaging with photoactivation.
12/16/2013 SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, was named MEMS Supplier of the Year at the MEMS Executive Congress U.S. 2013 held in Napa last month
