12/05/2013 NIKKISO CO. has announced that it has initiated shipments of commercial LED product samples emitting at a range of wavelengths in the UVB and UVC spectral regimes for industrial, biomedical, and environmental applications.
12/04/2013 STMicroelectronics announced that its 5.1 mega-pixel camera module and low-power digital image processor are being used in the revolutionary OrCam camera, a small device that clips on to eyeglasses and dramatically improves the mobility and ability of visually-impaired people to "read" signs, packaging and publications.
12/04/2013 Lynk Labs Inc., a AC LED technology company from circuits to systems has been granted another key patent by the US Patent Office. The patent covers vertical market segments of AC LED technology from the core AC LED circuits and powering methods to the lighting system level.
12/04/2013 Soitec, a manufacturer semiconductor materials for the electronics and energy industries, today announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity (eSI) substrates, enabling cost-effective and high-performance radio-frequency (RF) devices.
12/03/2013 A partnership among the University of Virginia's (UVa) Schools of Education and Engineering and the Charlottesville Public Schools has led to the launch of Buford Engineering Design Academy, a laboratory school for advanced manufacturing.
12/03/2013 Sankalp Semiconductor Private Limited, a leading Analog Mixed-Signal services and solutions company from India, announced today the appointment of Mr. Dan Clein into its management team. Dan will be based out of the North America region.
12/03/2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 720 automated UV nanoimprint lithography (UV-NIL) system.
11/27/2013 Semiconductor Industry Association (SIA) president and CEO Brian Toohey has announced his plans to leave the association in 2014 to join New Hampshire-based DEKA Research & Development Corporation as executive vice president.
11/27/2013 CEA-Leti today announced a development agreement that will utilize LetiÂ’s deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, healthcare and consumer-goods industries.
11/26/2013 Soitec and SunEdison, Inc. announced today that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products.
