10/21/2013 In a paper appearing in Nature's Scientific Reports, Dr. Ramesh Mani, professor of physics and astronomy at Georgia State University, reports that a giant magnetoresistance effect depends on the physical size of the device in the GaAs/AlGaAs semiconductor system.
10/17/2013 ParkerVision, Inc., a developer and marketer of semiconductor technology solutions for wireless applications, today announced that a jury in the U.S. District Court for the Middle District of Florida found Qualcomm Incorporated guilty of direct and indirect infringement of ParkerVision patents.
10/17/2013 MEMS Technology Showcase will give MEMS Executive Congress US attendees an intimate look at some of the most unique and inspiring MEMS-enabled applications in the business. After a competitive application process, MEMS Industry Group (MIG) has selected five finalists that show how MEMS enhances the consumer experience, highlighting the “MEMS inside the machine.”
10/17/2013 When facilities management and water treatment company MSS Group was called in to clean up the process water in a globally renowned manufacturer of semiconductor wafers, the company was presented with an untreated water system suffering from significant corrosion.
10/16/2013 Applied Materials, Inc. today announced new technology systems for manufacturing large size and ultra-high definition (UHD) LCD and OLED displays that meet the demand for greater screen performance, clarity, color and brightness.
10/16/2013 Nanoelectronics research center imec and Excico have successfully demonstrated the application of laser thermal anneal (LTA) to boost the current in vertical polysilicon channel devices for 3D memory.
10/16/2013 Largely driven by demand from upscale Samsung smartphones, particularly the Galaxy S4, global shipments of high-end active-matrix organic light-emitting diode (AMOLED) display panels posted impressive sequential growth of 16 percent in the second quarter.
10/16/2013 For several technology nodes now, designers have been required to run lithography-friendly design (LFD) checks prior to tape out and acceptance by the foundry. Due to resolution enhancement technology (RET) limitations at advanced nodes, we are seeing significantly more manufacturing issues, even in DRC-clean designs.
10/15/2013 Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of Roger Wendelken as senior vice president of worldwide sales effective immediately.
10/15/2013 Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs).
10/15/2013 At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.
10/10/2013 NYÂ’s Marcy Nanocenter, the largest remaining shovel-ready, greenfield site in New York StateÂ’s Tech Valley near Utica, is another step closer to the goal of attracting major semiconductor manufacturing companies.
10/10/2013 SEMI believes that the semiconductor materials market will trend with the device market, resulting in an increase of one percent this year and a seven percent increase in 2014, resulting in a materials market approaching $50 billion in 2014.
