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08/07/2018  Achronix Semiconductor Corporation today announced availability of an optimized High-Level Synthesis (HLS) flow from its partner, Mentor, a Siemens business, for its FPGA technology products.

08/06/2018  UMC will offer cost effective licensing of embedded 28nm non-volatile MRAM macros to its foundry customers.

08/06/2018  Samsung Electronics Co., Ltd. today announced that it has begun mass producing the industryÂ’s first 4-bit (QLC, quad-level cell) 4-terabyte (TB) SATA solid-state drive (SSD) for consumers.

08/06/2018  Rice University scientists test material that shows promise for flexible electronics.

08/03/2018  A UCF physicist has discovered a new material that has the potential to become a building block in the new era of quantum materials, those that are composed of microscopically condensed matter and expected to change our development of technology.

08/03/2018  A new research report from Semico Research estimates that the semiconductor content for energy harvesting solutions will explode to $3.4 billion by 2022. 

08/03/2018  Entegris, Inc. today released the next generation EUV 1010 Reticle Pod for high-volume IC manufacturing using extreme ultraviolet (EUV) lithography.

08/03/2018  A material already known for its unique behavior is found to carry current in a way never before observed.

08/02/2018  The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories.

08/02/2018  A new review looks at the booming industry of measuring 'every breath you take and every move you make'.

08/02/2018  Partnership enables UMC to develop and manufacture products utilizing Invensas DBI and ZiBond technologies.

08/02/2018  Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the integrated-circuit industry's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

08/01/2018  Keysight MX0100A InfiniiMax micro probe head designed to access small geometry, high density target devices.

08/01/2018  Toshiba Memory Corporation today announced that it consummated the merger with K. K. Pangea which is its parent company on August 1, 2018.

08/01/2018  They have demonstrated a strong light-matter interaction in suspensions and self-assembled films of tungsten disulfide nanotubes.

08/01/2018  Silicon-based system offers smaller, cheaper alternative to other 'broadband' filters; could improve a variety of photonic devices.

07/31/2018  Avnet, a global technology company, has been named a global distribution partner for Microsemi Corporation, a wholly owned subsidiary of Microchip Technology, Inc.

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors