07/25/2018 DARPA selects research teams from industry, academia to receive funding through its Electronics Resurgence Initiative to bolster next-generation semiconductor design, materials, architectures.
07/25/2018 SiFive, a provider of commercial RISC-V processor IP, today announced Brad Holtzinger as Vice President of Worldwide Sales, where he will work with the existing global portfolio of SiFive customers and onboard new clients seeking to take advantage of the company's market-leading Core IP.Â
07/25/2018 Each issue of the journal Nature Electronics contains a column called 'Reverse Engineering,' which examines the development of an electronic device now in widespread use from the viewpoint of the main inventor. The July 2018 column tells the story of the IGZO thin film transistor (TFT) through the eyes of Professor Hideo Hosono of Tokyo Tech's Institute of Innovative Research (IIR), who is also director of the Materials Research Center for Element Strategy.
07/25/2018 TheXcerra MT2168 XT pick-and-place handler was installed for a tri-temp module test application at a major player in global semiconductor manufacturing.
07/25/2018 Global billings of North American equipment manufacturers declined for the current month by 8 percent from the historic high but is still 8 percent higher than billings for the same period last year.
07/24/2018 On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory.
07/24/2018 Applied Materials, Inc. today announced it has been awarded a contract by the Defense Advanced Research Projects Agency (DARPA) to develop a new type of electronic switch for artificial intelligence that mimics the way the human brain works to enable dramatic improvements in performance and power efficiency.
07/24/2018 Imec, a research and innovation hub in nanoelectronics, energy and digital technology, within the partnership of EnergyVille, today announced a record result for its 4-terminal Perovskite/silicon tandem photovoltaic cell.
07/23/2018 Park Systems announced the opening of the Park Nanoscience Lab at the prestigious Indian Institute of Science (IISC) Bangalore India, which has been upgraded to the status of Institute of Eminence.
07/23/2018 Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.
07/23/2018 Using advanced fabrication techniques, engineers at the University of California San Diego have built a nanosized device out of silver crystals that can generate light by efficiently "tunneling" electrons through a tiny barrier. The work brings plasmonics research a step closer to realizing ultra-compact light sources for high-speed, optical data processing and other on-chip applications.
07/20/2018 A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.
07/20/2018 The Japan semiconductor manufacturing supply chain is a global semiconductor industry workhorse, producing about one third of world's chip equipment and more than half of its semiconductor materials.
07/20/2018 Storage and memory chipmaker and SEMI China member Tsinghua Unigroup is gearing up to meet burgeoning product demand with huge investments in its manufacturing plants.
07/19/2018 Rahul Goyal of Intel has been elected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.
