07/12/2018 3D-Micromac AG (booth #1645 in the South Hall) this week introduced the microPREP 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis (FA).
07/12/2018 KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the leading-edge logic and memory nodes.
07/12/2018 Gases and engineering company The Linde Group (Booth #5644 in the North hall) is investing in expansion of existing products to improve business continuity planning while adding new products with improved purity to meet the growing needs of sub-10nm semiconductor factories and advanced flat panel manufacturers
07/12/2018 To fulfill the promise of the Internet of Things (IoT), the world needs low-cost high-bandwidth radio-frequency (RF) chips for 5th-generation (5G) internet technology.
07/12/2018 The Mid-Year Update to the 2018 McClean Report revises IC InsightsÂ’ worldwide economic and IC industry forecasts through 2022 that were originally presented in The 2018 McClean Report issued in January.
07/12/2018 Nitrous oxide (N2O) has a variety of uses in the semiconductor manufacturing industry. It is the oxygen source for chemical vapor deposition of silicon oxy-nitride (doped or undoped) or silicon dioxide, where it is used in conjunction with deposition gases such as silane.
07/11/2018 HEIDENHAIN announced the appointment of David Doyle as CEO of HEIDENHAIN CORPORATION, effective Oct. 1, 2018. Â At that time, Doyle will assume full responsibility for the HEIDENHAIN CORPORATION customer-focused operations for the U.S., Canada and Mexico.
07/11/2018 The importance of data gathered and analysed in the subfab – the place where vacuum pumps, abatements systems and other supporting equipment operates – is growing. Increasingly, manufacturers are finding that these systems have a direct impact on yield, safety, cost-of-ownership and ultimately capacity and cycle time.
07/11/2018 As the commercial IC fabrication industry continues to shrink field-effect transistor (FET) sizes, 2D planar structures evolved into 3D fins which are now evolving into 3D stacks of 2D nano-sheets.
07/11/2018 Intel has won SEMI's 2018 Award for the Americas. SEMI honored the celebrated chipmaker for pioneering process and integration breakthroughs that enabled the first high-volume Integrated Silicon Photonics Transceiver. The award was presented yesterday at SEMICON West 2018.
07/11/2018 SEMI yesterday honored two industry leaders at SEMICON West 2018 for their outstanding accomplishments in developing Standards for the electronics and related industries.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
07/09/2014 Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.
