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Imec demonstrates hybrid finFET-silicon photonics technology for ultra-low power optical I/O

07/09/2018  Today at its Imec Technology Forum USA in San Francisco, imec, the research and innovation hub in nano-electronics and digital technology, announced that it has demonstrated ultra-low power, high-bandwidth optical transceivers through hybrid integration of Silicon Photonics and FinFET CMOS technologies.

SEMICON West 2018 highlights smart technologies, workforce development, industry growth

07/09/2018  Smart technologies take center stage tomorrow as SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, opens for three days of insights into leading technologies and applications that will power future industry expansion.

Heat-conducting crystals could help computer chips keep their cool

07/06/2018  Researchers at the University of Texas at Dallas and their collaborators have created and characterized tiny crystals of boron arsenide.

Exciton limits are meant to be broken: OLED surpasses 100 percent exciton production efficiency

07/06/2018  Splitting energy using singlet fission opens a new route toward OLEDs with high-intensity emission in the near-infrared.

Strategy for U.S. semiconductor leadership to be previewed at SEMICON West

07/06/2018  White House-led panel to address U.S. goal to lead in development of next-generation microelectronics.

Merging antenna and electronics boosts energy and spectrum efficiency

07/05/2018  Research could lead to longer talk time and higher data rates in 5G devices.

Toshiba announces new analog output IC photocoupler for automotive applications

07/05/2018  Toshiba Electronic Devices & Storage Corporation announces the launch of a new analog output IC photocoupler that enables high-speed communications in automotive applications – especially electric vehicles (EV) and hybrid electric vehicles (HEV).

ROHM's new CMOS op-amp delivers leading-class low noise

07/05/2018  Ideal for industrial applications that demand high-accuracy sensing, including sonar and optical sensors.

Ultimate precision for sensor technology using qubits and machine learning

07/05/2018  Extracting information quickly from quantum states is necessary for future quantum processors and super-sensitive detectors in existing technologies.

Leti, Transdev, IRT Nanoelec announce pilot program to assess new perception sensors for autonomous vehicles

07/05/2018  Leti, a research institute at CEA Tech, Transdev, a global provider of mobility services, and IRT Nanoelec, an R&D center focused on information and communication technologies (ICT) using micro- and nanoelectronics, today announced a pilot program to characterize and assess LiDAR sensors to improve performance and safety of autonomous vehicles.

Process complexity means exponentially increasing data volumes and analysis challenges, with co-optimization across process steps

07/03/2018  The fast-maturing infrastructure that is enabling applications for big data and artificial intelligence means disruptive change not just at individual companies but also in data connections among companies across the microelectronics manufacturing value chain.

Smart devices are critical entry point to IoT ecosystem

07/03/2018  As smart functionality makes its way into homes and businesses, two devices are gaining a foothold into broader ecosystems to maximize growth and revenue opportunities: smart speakers and smart meters.

Ultimate precision for sensor technology using qubits and machine learning

07/03/2018  Extracting information quickly from quantum states is necessary for future quantum processors and super-sensitive detectors in existing technologies.

High performance nitride semiconductor for environmentally friendly photovoltaics

07/03/2018  A Tokyo Institute of Technology research team has shown copper nitride acts as an n-type semiconductor, with p-type conduction provided by fluorine doping, utilizing a unique nitriding technique applicable for mass production and a computational search for appropriate doping elements, as well as atomically resolved microscopy and electronic structure analysis using synchrotron radiation.

EV Group accelerates 3D-IC packaging roadmap with breakthrough wafer bonding technology

07/03/2018  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView NT3 aligner.

Automotive and SiP drive demand for traceability back through the value chain

07/02/2018  SEMI expands its smart manufacturing program with a Smart Manufacturing Pavilion with displays and three full days of talks to address these industry-wide developments at SEMICON West, July 10-12 in San Francisco.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.