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Interaction of paired and lined-up electrons can be manipulated in semiconductors

06/20/2018  The way that electrons paired as composite particles or arranged in lines interact with each other within a semiconductor provides new design opportunities for electronics, according to recent findings in Nature Communications.

North American semiconductor equipment industry posts May 2018 billings

06/20/2018  North America-based manufacturers of semiconductor equipment posted $2.70 billion in billings worldwide in May 2018 (three-month average basis), according to the May Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

imec presents complementary FET as scaling contender for nodes beyond N3

06/20/2018  At this weekÂ’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology, will present a process flow for a complementary FET (CFET) device for nodes beyond N3.

Could this material enable autonomous vehicles to come to market sooner?

06/19/2018  New material has optical properties that could enable better infrared detection for autonomous vehicles and assist firefighters.

Executive keynotes to identify MEMS, sensors, imaging innovations and megatrends at SEMI-MSIG European Summits

06/19/2018  Industry leaders to share latest developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018, in Grenoble, France.

SEMI-FlexTech invites proposals for flexible hybrid electronics advances

06/19/2018  FlexTech, a SEMI Strategic Association Partner, is now soliciting proposals for projects that advance flexible hybrid electronics (FHE) for sensors, power and other key electronic components.

Imec furthers high-mobility nanowire FETs for nodes beyond 5nm

06/19/2018  At this weekÂ’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology presented considerable progress in enabling germanium nanowire pFET devices as a practical solution to extend scaling beyond the 5nm node.

Global demand and supply for automotive display systems expected to maintain healthy growth in 2018

06/18/2018  The global demand for automotive display systems is expected to continue a strong growth path in 2018, according to recent analysis from business information provider IHS Markit.

FormFactor to collaborate with Keysight Technologies and GlobalFoundries

06/18/2018  FormFactor, Inc. (NASDAQ:FORM), an electrical test and measurement supplier to the semiconductor industry, announced today the company has deployed an integrated CM300xi probing solution for wafer-level testing of silicon photonics (SiPh) devices.

Scientists discover how to control the 'excitation' of electronics

06/18/2018  An international team of scientists, including NUST MISIS's Professor Gotthard Seifert, have made an important step towards the control of excitonic effects in two-dimensional van der Waals heterostructures.

Imec demonstrates manufacturability of spin-orbit torque MRAM devices on 300mm Si wafers

06/18/2018  At this weekÂ’s 2018 Symposia on VLSI Technology and Circuits, imec, the world-leading research and innovation hub in nanoelectronics and digital technology, demonstrates for the first time the possibility to fabricate spin-orbit torque MRAM (SOT-MRAM) devices on 300mm wafers using CMOS compatible processes.

Qualcomm extends cash tender offer for all outstanding shares of NXP

06/15/2018  Qualcomm Incorporated has extended the offering period of its previously announced cash tender offer to purchase all of the outstanding common shares of NXP Semiconductors N.V.

Micross announces new executive appointment

06/15/2018  Marshall (Mac) Blythe has joined Micross in the role of General Manager of Component Modification Services (CMS) located in Hatfield, PA.

FormFactor announces breakthrough improvements in productivity for RF probe systems

06/15/2018  FormFactor, Inc., a electrical test and measurement supplier to the semiconductor industry, has extended its Contact Intelligence technology.

pSemi GaN FET driver delivers fast switching to solid-state LiDAR systems

06/14/2018  pSemi Corporation (formerly known as Peregrine Semiconductor), a Murata company focused on semiconductor integration, announces the availability of the PE29101 gallium nitride (GaN) field-effect transistor (FET) driver for solid-state light detection and ranging (LiDAR) systems.

Synopsys IC Validator certified by Samsung Foundry for 7nm signoff physical verification

06/14/2018  Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys' IC Validator has been certified by Samsung Foundry for signoff of all designs using its 7-nanometer (nm) Low Power Plus (LPP) process with Extreme Ultraviolet (EUV) lithography technology.

Synopsys Fusion Technology enables lower power, high performance on Samsung Foundry 7LPP process with EUV

06/14/2018  Synopsys, Inc. (Nasdaq: SNPS) today announced that Samsung Foundry has certified the Synopsys Design Platform with Fusion Technology for 7-nanometer (nm) Low Power Plus (LPP) process with Extreme Ultraviolet (EUV) lithography technology.

Wireless technologies to comprise 55% of connectivity IC shipments in 2018

06/14/2018  Driven by the colossal Internet of Things (IoT) opportunity, wireless technologies—including wireless local area network (WLAN), Bluetooth, cellular and low-power wireless—will account for 55 percent of connectivity integrated circuit (IC) shipments in 2018, according to a new report from business information provider IHS Markit

Industrial internet and connected vehicles drive IoT sales through 2021?

06/14/2018  IC Market Drivers 2018 Update maintains solid revenue growth across all IoT end-use systems.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.