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Maximize uptime and optimize maintenance with AMS

06/13/2018  Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time.

WIN Semiconductors releases new platform integrating high performance 0.1um GaAs pHEMT with monolithic PIN and vertical Schottky diodes

06/13/2018  WIN Semiconductors Corp, the world's largest pure-play compound semiconductor foundry, has expanded its portfolio of highly integrated GaAs technologies with the release of a new pHEMT technology.

Aledia selects Veeco Propel GaN MOCVD platform for large wafer 3D LED production

06/13/2018  Veeco Instruments Inc. has selected VeecoÂ’s Propel GaN MOCVD system to support advanced research and development.

Plasma-Therm completes acquisition of France-based CORIAL

06/13/2018  Plasma-Therm, the manufacturer of plasma etch, deposition, and advanced packaging equipment for the production of specialty semiconductor devices, announced today the successful acquisition of CORIAL, a France-based plasma processing equipment supplier.

NXP introduces new high power RF products for 5G networks

06/12/2018  Company expands its Gallium Nitride (GaN) and LDMOS technology portfolios to offer a full range of high power products.

SEMI Americas and Applied Materials host media and analyst lunch briefing at SEMICON West 

06/12/2018  Sparking conversation is a goal of SEMICON West, and SEMI Americas and Applied Materials invite working journalists across the electronics spectrum to a special AI Design Forum luncheon on Tuesday, July 10, from noon to 1:30 p.m., at The Forum at the Yerba Buena Center for the Arts, 701 Mission Street, in San Francisco. The event is presented in conjunction with SEMICON West at the Moscone Center.

pSemi expands digital step attenuator portfolio with high-performance DSAs

06/12/2018  pSemi Corporation, a Murata company focused on semiconductor integration, announces the expansion of its digital step attenuator (DSA) portfolio with a family of value, high-performance DSAs.

MEMS pressure sensor technologies: Multiple ways to success

06/11/2018  The MEMS pressure sensor market is still driven by automotive applications. Established automotive applications increase MEMS pressure sensors adoption in the integrating systems, and also widespread their geographical adoption especially in China thanks to new automotive regulation.

The MEMS market is showing a 17.5% CAGR between 2018 and 2023

06/11/2018  MEMS market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period.

Silicon provides means to control quantum bits for faster algorithms

06/11/2018  Research groups from Purdue University, the Technological University of Delft, Netherlands and the University of Wisconsin-Madison have discovered that silicon has unique spin-orbit interactions that can enable the manipulation of qubits using electric fields, without the need for any artificial agents.

Solar cells combining silicon with perovskite have achieved record efficiency of 25.2 percent

06/11/2018  Researchers from EPFL and CSEM have combined silicon- and perovskite-based solar cells. The resulting efficiency of 25.2 percent is a record for this type of tandem cell. Their innovative yet simple manufacturing technique could be directly integrated into existing production lines, and efficiency could eventually rise above 30 percent.

Winbond extends performance of Serial NAND Flash memory with 1Gbit device with maximum data-transfer rate of 83MB/s

06/08/2018  WinbondÂ’s new high-performance Serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s.

Cree announces CFO transition plan

06/08/2018  Cree, Inc. today announced that Executive Vice President and Chief Financial Officer (CFO) Mike McDevitt will retire from his executive positions following a transition period.

A nanotech sensor that turns molecular fingerprints into bar codes

06/08/2018  Scientists at EPFL's School of Engineering and at Australian National University (ANU) have developed a compact and sensitive nanophotonic system that can identify a molecule's absorption characteristics without using conventional spectrometry.

WIN Semiconductors releases 0.45µm GaN power process for 5G applications

06/08/2018  WIN Semiconductors Corp, the world?'s largest pure-play compound semiconductor foundry, has expanded its gallium nitride (GaN) process capabilities to include a 0.45?m-gate technology that supports current and future 5G applications.

Entegris announces agreement to acquire SAES Pure Gas business

06/07/2018  Entegris, Inc., a distributor of specialty chemicals and advanced materials solutions, announced today it has entered into a definitive agreement to acquire the SAES Pure Gas business.

Transparent, conductive films promising for developing flexible screens

06/07/2018  Researchers demonstrate silver-based electrode films that could be used for flexible touch displays, televisions and solar cells.

imec demonstrates compact low-power 140GHz CMOS radar with on-chip antennas

06/07/2018  The achievement is an important step in the development of radar-based sensors for a myriad of smart intuitive applications, such as building security, remote health monitoring of car drivers, breathing and heart rate of patients, and gesture recognition for man-machine interaction.

Leading the world beyond Moore's Law to the AI era, six cognitive experts to keynote at SEMICON West

06/07/2018  With the rapid rise of AI providing overwhelming possibilities for industry growth, SEMICON West has been designed to help the microelectronics industry get a firm handle on how best to enable and take advantage of AI's potential.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.