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CWS upgrades on-wafer accelerated reliability line for Agilent testers

01/24/2012 

Core Wafer Systems, subsidiary of Action Products International, upgraded its PDQ-WLR on-wafer accelerated reliability product line to version 7.0, designed specifically for Agilent Technologies' Parametric Testers.

Rapid LCD TV shift to 40"+ display panels signals production capacity boost

01/24/2012 

The LCD TV market saw a rapid shift toward sizes larger than 40" at the end of 2011, as consumers, particularly in North America and China, took advantage of new sizes and affordable prices. The increase in LCD TV area demand means more capacity consumption.

Silex devs wafer-level MEMS fab technologies for mobile devices

01/23/2012 

Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.

North American semiconductor equipment ends 2011 with another book-to-bill climb

01/23/2012 

North America-based manufacturers of semiconductor equipment posted $1.16 billion in orders in December 2011, $1.32 billion in billings, and a book-to-bill ratio of 0.88, according to SEMI. The book-to-bill ratio has been climbing since September 2011. In December, bookings climbed back above the $1 billion mark.

New biochip measures glucose in saliva, not blood

01/23/2012 

Researchers at Brown University are working on a new sensor, based on plasmaonic interferometers, that can check blood sugar levels by measuring glucose concentrations in saliva instead.

Mask writer collaboration announced: IMS Nanofabrication, DNP, Intel and Photronics

01/23/2012 

IMS Nanofabrication, Dai Nippon Printing Co., Ltd. (DNP), Intel Corporation, and Photronics Inc. are commencing a joint electron multi?beam mask writer tool collaboration.

Texas Instruments (TI) debuts DLP evaluation module

01/23/2012 

Texas Instruments (TI, NASDAQ:TXN) DLP Products released DLP LightCrafter, an advanced, compact evaluation module for TI's spatial light steering DLP technology. The evaluation kit is built around the reference design for TIÂ’s 0.3" WVGA resolution DLP chipset.

Intel, Samsung, TSMC semiconductor capex in 2012 signal market dominance

01/23/2012 

Intel plans $12.5 billion semiconductor capital expeditures in 2012; Samsung plans $12.2 billion. Watch for wide and growing separation between these two companies and their competition, says IC Insights.

Mobile semiconductor companies see high M&A, flat growth

01/20/2012 

2011 was a big year for M&A in the mobile device semiconductor market, from IntelÂ’s acquisition of Infineon Technologies AG Wireless Solutions, Qualcomm's Atheros buy, to NVIDIAÂ’s purchase of Icera. Despite all the M&A activity, however, the market is still projected to remain relatively flat.

Present at MEMS and nano manufacturing conferences in the UK

01/20/2012 

MM, MEMS & NANO Live UK 2012 will take place at NEC Birmingham, UK, September 25-26, co-located with TCT Live, Mediplas, and Sensing Technology 2012.. Submit an abstract by February 28.

Seoul Semiconductor LED patents top 10K mark

01/20/2012 

Seoul Semiconductor Co. Ltd. has applied, registered, and secured more than 10,000 patents for light emitting diodes (LEDs) globally. The company invests 10-20% of its annual revenue in R&D.

Purdue's simplified microtweezers construct MEMS, advanced sensors

01/20/2012  Purdue University researchers have created microtweezers for the manufacture of tiny structures in MEMS, printing coatings on advanced sensors, and live stem cell sphere manipulation.

Semiconductor industry veteran takes helm at Minco Technology Labs

01/20/2012 

Minco Technology Labs, hi-rel semiconductor die processing, packaging and test provider, appointed board member Bill Bradford as president and CEO.

Samsung Electronics ramps embedded multi-chip packaging with memory products

01/19/2012 

Samsung Electronics began producing embedded multi-chip package (eMCP) memory for use in entry- to mid-level smartphones. The products use low power double-data-rate 2 (LPDDR2) 30nm DRAM and 20nm NAND flash memory.