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Norcada microporous silicon nitride sample holders suit thin film study

01/17/2012 

Norcada launched 2 microporous silicon nitride TEM sample holders, suiting ALD analysis, thin film growth, and other applications under TEM, SEM, or STXM tools.

ISS kicks off with IC industry reality talks

01/17/2012 

The Industry Strategy Symposium (ISS) kicked off today in Half Moon Bay, CA under blustery skies with choppy seas, an apt metaphor for the information about to be shared inside, says blogger Michael A. Fury, Techcet.

Energy harvesting powers up commercialization in 2012

01/16/2012 

The analysts at IDTechEx look at the year past and the year ahead for energy harvesting devices, such as rising power in piezoelectric harvesters, and new energy harvester products.

Neonode licenses optical touchscreen tech to OEM

01/16/2012 

Neonode Inc. signed a technology license agreement with a global consumer OEM. The unnamed customer will integrate Neonode's zForce optical touchscreen technology with color LCD panels on consumer devices

Baolab intros eval kits for CMOS-integrated MEMS tech

01/16/2012 

Baolab Microsystems is launching evaluation kits of its 3D CMOS MEMS NanoCompass technology. Baolab's NanoEMS technology creates nanoscale MEMS within the standard metal structure of a high-volume-manufactured CMOS wafer.

Organic printed electronics roadmap recognizes market entry

01/16/2012 

The Organic Electronics Association released its "OE-A Roadmap for Organic and Printed Electronics," covering application clusters such as flexible displays and smart systems, as well as the outlook on materials, substrates, and patterning processes.

New installed wafer capacity leader: Taiwan took over in 2011

01/16/2012 

Taiwan became the region with the largest share of installed wafer capacity in 2011, according to IC Insights' Global Wafer Capacity 2011-12 report. This is the first time Taiwan has led the global wafer capacity rankings, with 21% of total in mid-2011.

Taiwan's LED makers' and packagers' 2011 results

01/13/2012 

Taiwan's LED chip and package manufacturers failed to reproduce the booming revenue growth of H1 2011 in H2, according to LEDinside. Given inventory pressure, many LED makers are actively seeking joint ventures and improving product quality to create greater product differentiation.

Renesas Electronics America taps company veteran as president and CEO

01/13/2012 

Renesas Electronics America Inc. named Ali Sebt, who has served 20 years at the company, as its new president and CEO. Sebt succeeds the retiring Daniel Mahoney.

IBM discovers magnetic storage limit at 12 atoms

01/13/2012 

IBM Research demonstrated the ability to store information in as few as 12 magnetic atoms, 100-10,000x less than today's information storage technologies.

Thin Film Electronics, Lockheed Martin execs join FlexTech Alliance

01/13/2012 

Jennifer Ernst of Thin Film Electronics and Michael C. Dudzik of Lockheed Martin have joined the Governing Board of FlexTech Alliance, a group focused on developing the electronic display and flexible printed electronics industry supply chains.

Qualcomm MEMS Technologies reports 2 e-reader design wins in China

01/12/2012 

Qualcomm MEMS Technologies Inc.'s mirasol display technology is used in 2 new e-readers for the Chinese market, the Hanvon C18 and the Bambook Sunflower from Shanda Networking.

OSRAM fabs LED chips on silicon

01/12/2012 

OSRAM Opto Semiconductors manufactured high-performance LED prototypes, growing the light-emitting gallium-nitride (GaN) layers on 150mm silicon (Si) wafers rather than sapphire substrates.

Semiconductor inventory correction balancing out early in 2012

01/12/2012 

Semiconductor sales were weaker than expected in Q3 2011, and Q4 shows weak guidance, prompting chip makers to reduce production. Gartner expects this inventory correction to work out in early 2012.